Integrated radio frequency component packaging structure and manufacturing method thereof
GUI NIANLONG, ZHOU XIAOLEI, ZHAO HONGBO, WANG KAI, HE SHIXIN, KANG WENBIN
Year of Publication 12.08.2022
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Year of Publication 12.08.2022
Patent
Integrated radio frequency component packaging structure
GUI NIANLONG, ZHOU XIAOLEI, ZHAO HONGBO, WANG KAI, HE SHIXIN, KANG WENBIN
Year of Publication 19.07.2022
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Year of Publication 19.07.2022
Patent