Creep measurement and choice of creep laws for BGA assemblies' reliability simulation
Pin, S., Guédon-Gracia, A., Delétage, J.-Y., Frémont, H.
Published in Microelectronics and reliability (01.09.2018)
Published in Microelectronics and reliability (01.09.2018)
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Journal Article
Effects of salt spray test on lead-free solder alloy
Guédon-Gracia, A., Frémont, H., Plano, B., Delétage, J.-Y., Weide-Zaage, K.
Published in Microelectronics and reliability (01.09.2016)
Published in Microelectronics and reliability (01.09.2016)
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Journal Article
Impact of temperature on the corrosion of lead-free solder alloy during salt spray test
Akoda, K.E., Guédon-Gracia, A., Delétage, J.-Y., Plano, B., Frémont, H.
Published in Microelectronics and reliability (01.11.2021)
Published in Microelectronics and reliability (01.11.2021)
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Journal Article
Early microstructural indicators of crack initiation in lead-free solder joints under thermal cycling
Ben Romdhane, E., Roumanille, P., Guedon-Gracia, A., Pin, S., Nguyen, P., Fremont, H.
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage
Berthou, M., Retailleau, P., Frémont, H., Guédon-Gracia, A., Jéphos-Davennel, C.
Published in Microelectronics and reliability (01.09.2009)
Published in Microelectronics and reliability (01.09.2009)
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Journal Article
Conference Proceeding
Corrosion study on BGA assemblies
Guedon-Gracia, A., Fremont, H., Deletage, J.-Y, Weide-Zaage, K.
Published in 2016 Pan Pacific Microelectronics Symposium (Pan Pacific) (01.01.2016)
Published in 2016 Pan Pacific Microelectronics Symposium (Pan Pacific) (01.01.2016)
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Conference Proceeding
Comparative study of lead-free alloys submitted to thermomechanical ageing
Friaa, H., Guedon-Gracia, A., Fremont, H., Riva, R., Rocheron, L.
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07.04.2024)
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07.04.2024)
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Conference Proceeding
Using X-ray imaging for the study of crack development in solder reliability testing
Roumanille, P., Lesseur, J., Uzanu, J., Le Trong, H., Ben Romdhane, E., Guédon-Gracia, A., Frémont, H.
Published in Microelectronics and reliability (01.11.2023)
Published in Microelectronics and reliability (01.11.2023)
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Journal Article
Evaluation of SAC solder joint thermomechanical fatigue in different types of components
Romdhane, E. Ben, Roumanille, P., Guedon-Gracia, A., Pin, S., Nguyen, P., Fremont, H.
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
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Conference Proceeding
QFN (Quad Flat No-lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms
Ben Romdhane, E., Roumanille, P., Guedon-Gracia, A., Pin, S., Nguyen, P., Fremont, H.
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Dynamics of the corrosion for SAC305 solder alloy in salt environment
Akoda, K. E., Guedon-Gracia, A., Lebraud, E., Deletage, J.-Y., Plano, B., Fremont, H.
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
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Conference Proceeding
Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability
Guédon-Gracia, A., Woirgard, E., Zardini, C.
Published in Microelectronics and reliability (01.09.2005)
Published in Microelectronics and reliability (01.09.2005)
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Journal Article
Conference Proceeding
First step in the reliability assessment of ultracapacitors used as power source in hybrid electric vehicles
LAJNEF, W, VINASSA, J. M, AZZOPARDI, S, BRIAT, O, GUEDON-GRACIA, A, ZARDINI, C
Published in Microelectronics and reliability (01.09.2004)
Published in Microelectronics and reliability (01.09.2004)
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Journal Article
Conference Proceeding
Electrically driven matter transport effects in PoP interconnections
Feng, W., Weide-Zaage, K., Verdier, F., Plano, B., Guedon-Gracia, A., Fremont, H.
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
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Conference Proceeding
Moisture induced effects in PoP
Guedon-Gracia, A., Feng, W., Deletage, J.-Y., Verdier, F., Fremont, H.
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
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Conference Proceeding