Endpoint Detection in Low Open Area TSV Fabrication Using Optical Emission Spectroscopy
Ja Myung Gu, Thadesar, Paragkumar A., Dembla, Ashish, Bakir, Muhannad S., May, Gary S., Sang Jeen Hong
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2014)
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Journal Article
Novel photodefined polymer-clad through-silicon via technology integrated with endpoint detection using optical emission spectroscopy
Thadesar, Paragkumar A., Ja Myung Gu, Dembla, Ashish, Sang Jeen Hong, May, Gary S., Bakir, Muhannad S.
Published in ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference (01.05.2013)
Published in ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference (01.05.2013)
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Conference Proceeding
Virtual metrology for TSV etch depth measurement using optical emission spectroscopy
Ja Myung Gu, Sang Jeen Hong
Published in 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01.12.2015)
Published in 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01.12.2015)
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Conference Proceeding
Endpoint detection using optical emission spectroscopy in TSV fabrication
Ja Myung Gu, Thadesar, Paragkumar A., Dembla, Ashish, Sang Jeen Hong, Bakir, Muhannad S., May, Gary S.
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
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Conference Proceeding
Calibrator of an optical emission spectroscopy
Lee, Hyung-Joo, Hwang, Jae-Woong, Gu, Ja-Myung, An, Jong-Hwan, Sun, Jong-Woo, Mun, Jeong-Il
Year of Publication 25.08.2020
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Year of Publication 25.08.2020
Patent
CALIBRATOR OF AN OPTICAL EMISSION SPECTROSCOPY
SUN, Jong-Woo, AN, Jong-Hwan, HWANG, Jae-Woong, MUN, Jeong-Il, LEE, Hyung-Joo, GU, Ja-Myung
Year of Publication 03.10.2019
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Year of Publication 03.10.2019
Patent