by GROTELÜSCHEN, E, DYCK, K.-P, GRABINSKI, H
Published in Electrical engineering (01.07.1992)

by Zaage, S., Groteluschen, E.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.11.1993)

by Grotelüschen, E., Dutta, L.S., Zaage, S.
Published in Integration (Amsterdam) (1993)

by Winkel, T.-M., Dutta, L.S., Grabinski, H., Groteluschen, E.
Published in Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) (1996)

by GROTELÜSCHEN, E, DUTTA, L. S, ZAAGE, S
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (1994)

by Groteluschen, E., Dutta, L.S., Zaage, S.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.08.1994)

by Zaage, S., Groteluschen, E.
Published in 1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration (1993)

by Groteluschen, E., Dutta, L.S., Zaage, S.
Published in Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI) (1994)

by GROTELUESCHEN,HERMANN,DE
Year of Publication 09.08.1978