An experimental investigation of the data delivery performance of a wireless sensing unit designed for structural health monitoring
Pei, Jin-Song, Kapoor, Chetan, Graves-Abe, Troy L., Sugeng, Yohanes P., Lynch, Jerome P.
Published in Structural control and health monitoring (01.06.2008)
Published in Structural control and health monitoring (01.06.2008)
Get full text
Journal Article
Three-Dimensional Dynamic Random Access Memories Using Through-Silicon-Vias
Kirihata, Toshiaki, Golz, John, Wordeman, Matthew, Batra, Pooja, Maier, Gary W., Robson, Norman, Graves-abe, Troy L., Berger, Daniel, Iyer, Subramanian S.
Published in IEEE journal on emerging and selected topics in circuits and systems (01.09.2016)
Published in IEEE journal on emerging and selected topics in circuits and systems (01.09.2016)
Get full text
Journal Article
Implant after through-silicon via (TSV) etch to getter mobile ions
Greene, Brian J, Graves-Abe, Troy L, Collins, Christopher, Hannon, Robert, Ho, Herbert L, Farooq, Mukta G, Kothandaraman, Chandrasekharan
Year of Publication 01.01.2019
Get full text
Year of Publication 01.01.2019
Patent