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Mounting device and method of connecting miniaturized electronic components by bump connections
by
GOODMAN THOMAS W C O SONY CORP
,
MURPHY ARTHUR T
,
FUJITA HIROYUKI C O SONY CORPO
,
MURAKAMI YOSHIKAZU C O SONY CO
Year of Publication
11.01.1995
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Patent
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chemistry
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medicine
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sciences
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basic electric elements
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casings or constructional details of electric apparatus
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electric solid state devices not otherwise provided for
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electric techniques not otherwise provided for
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electricity
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manufacture of assemblages of electrical components
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esp@cenet
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