Membrane-supported LSI with integrated heater and temperature monitor for on-site annealing-recovery from 20 kGy gamma ray irradiation damage
Gong, Tianjiao, Suzuki, Yukio, Takeyama, Akinori, Ohshima, Takeshi, Tanaka, Shuji
Published in Sensors and actuators. A. Physical. (16.08.2022)
Published in Sensors and actuators. A. Physical. (16.08.2022)
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Journal Article
Investigation of Vapor HF Sacrificial Etching Characteristics Through Submicron Release Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal
Gong, Tianjiao, Suzuki, Yukio, Khan, Muhammad Jehanzeb, Hiller, Karla, Tanaka, Shuji
Published in Journal of microelectromechanical systems (01.08.2023)
Published in Journal of microelectromechanical systems (01.08.2023)
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Journal Article
Single Pascal Vacuum Sealing of MEMS Resonator by Silicon Migration Wafer-Level Packaging Witiout Getter
Suzuki, Yukio, Khan, Muhammad Jehanzeb, Honda, Munehiro, Miyashita, Hidetoshi, Gong, Tianjiao, Tsukamoto, Takashiro, Tanaka, Shuji
Published in 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) (25.06.2023)
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Published in 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) (25.06.2023)
Conference Proceeding
Characterization of Vapor HF Sacrificial Etching Through Submicron Relase Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal
Gong, Tianjiao, Suzuki, Yukio, Khan, Muhammad J., Hiller, Karla, Tanaka, Shuji
Published in 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) (15.01.2023)
Published in 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) (15.01.2023)
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Conference Proceeding
Mems Resonator Vacuum-Sealed by Silicon Migration and Hydrogen Outdiffusion
Khan, Muhammad Jehanzeb, Suzuki, Yukio, Gong, Tianjiao, Tsukamoto, Takashiro, Tanaka, Shuji
Published in 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) (15.01.2023)
Published in 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) (15.01.2023)
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Conference Proceeding
High Light Power Density DUV-LED Packaging Using High Density TSV in Silicon Cavity and Laser-Glass-Frit-Bonded Glass Cap
Chiba, Hirofumi, Suzuki, Yukio, Yasuda, Yoshiaki, Gong, Tianjiao, Tanaka, Shuji
Published in 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) (20.06.2021)
Published in 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) (20.06.2021)
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Conference Proceeding
Membrane-Heater-Integrated LSI for On-Site Annealing-Recovery from 20 KGY Gamma Ray Irradiation Damage
Gong, Tianjiao, Suzuki, Yukio, Takeyama, Akinori, Ohshima, Takeshi, Tanaka, Shuji
Published in 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS) (25.01.2021)
Published in 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS) (25.01.2021)
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Conference Proceeding
Method for detecting residual drugs in anti-tumor drug packaging container and application of method
ZHU JIUQUN, SONG YUJIE, ZOU LINKE, HAO MENGLIN, WANG TING, GONG TIANJIAO, LIU JING, YAN JUNFENG
Year of Publication 18.09.2020
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Year of Publication 18.09.2020
Patent
Method for detecting drug leakage of robot intelligent dispensing system
ZHU JIUQUN, SONG YUJIE, ZOU LINKE, HAO MENGLIN, WANG TING, GONG TIANJIAO, LIU JING, YAN JUNFENG
Year of Publication 15.09.2020
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Year of Publication 15.09.2020
Patent
Deodorizing microbial agent and application thereof
GUO HONGRU, PIAO YULAN, ZHOU YING, YANG SHUFANG, ZHANG CHUNYANG, FU YUAN, ZHANG HAIDONG, SUN JIHONG, GONG TIANJIAO
Year of Publication 30.03.2021
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Year of Publication 30.03.2021
Patent