Thermodynamic Design and Performance Calculation of the Thermochemical Reformers
Pan, Fumin, Cheng, Xiaobei, Wu, Xin, Wang, Xin, Gong, Jingfeng
Published in Energies (Basel) (27.09.2019)
Published in Energies (Basel) (27.09.2019)
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Journal Article
Automobile tire pressure monitoring technology and development trend
Xin, Quan, Jingfeng, Gong, Junjie, Guan, ri, Bai, Mingxing, You, Pian, Zou
Published in Journal of physics. Conference series (01.10.2019)
Published in Journal of physics. Conference series (01.10.2019)
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Journal Article
A penalty-based cell vertex finite volume method for two-dimensional contact problems
Xuan, Lingkuan, Yan, Chu, Gong, Jingfeng, Li, Chenqi, Li, HongGang
Published in Computational mechanics (03.07.2024)
Published in Computational mechanics (03.07.2024)
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Journal Article
Numerical simulation and experimental investigation on thermal characteristics during induction rolling welding of Fe/Al dissimilar metals
Gao, Kai, Dai, Xinglei, Gong, Jingfeng, Ye, Kai, Li, Kun, Lei, Xianzhen
Published in International communications in heat and mass transfer (01.01.2024)
Published in International communications in heat and mass transfer (01.01.2024)
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Journal Article
Effect of post-weld heat treatment on microstructure and mechanical properties of induction pressure welded joint for A283GRC steel and 5052 aluminum alloy
Gao, Kai, Ye, Kai, Gong, Jingfeng, Dai, Xinglei, Gu, Hongli, Lei, Xianzhen
Published in Materials today communications (01.12.2023)
Published in Materials today communications (01.12.2023)
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Journal Article
An Unstructured Finite-Volume Method for Transient Heat Conduction Analysis of Multilayer Functionally Graded Materials with Mixed Grids
Gong, Jingfeng, Xuan, Lingkuan, Ming, Pingjian, Zhang, Wenping
Published in Numerical heat transfer. Part B, Fundamentals (01.03.2013)
Published in Numerical heat transfer. Part B, Fundamentals (01.03.2013)
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Journal Article
Flexible transfer of aligned carbon nanotube films for integration at lower temperature
Chai, Yang, Gong, Jingfeng, Zhang, Kai, Chan, Philip C H, Yuen, Matthew M F
Published in Nanotechnology (05.09.2007)
Published in Nanotechnology (05.09.2007)
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Journal Article
Reliability Evaluation of Carbon Nanotube Interconnect in a Silicon CMOS Environment
Yang Chai, Min Zhang, Jingfeng Gong, Chan, P.C.H.
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
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Conference Proceeding
Low Temperature Transfer of Aligned Carbon Nanotube Films Using Liftoff Technique
Yang Chai, Jingfeng Gong, Kai Zhang, Chan, P.C.H., Yuen, M.M.F.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding