CR018 Wideband Noise Model for AMS/RF CMOS Simulation
Yang, M.T., Kuo, C.W., Ho, P.P.C., Kuo, D.C.W., Chen, C.C., Yeh, T.J., Teng, C., Jayapalan, J., Brown, G., Yeap, G., Yang Du, Liu, S.
Published in 2007 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium (01.06.2007)
Published in 2007 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium (01.06.2007)
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Conference Proceeding
5nm CMOS Production Technology Platform featuring full-fledged EUV, and High Mobility Channel FinFETs with densest 0.021µm2 SRAM cells for Mobile SoC and High Performance Computing Applications
Yeap, Geoffrey, Chen, X., Yang, B. R., Lin, C. P., Yang, F. C., Leung, Y. K., Lin, D. W., Chen, C. P., Yu, K. F., Chen, D. H., Chang, C. Y., Lin, S. S., Chen, H. K., Hung, P., Hou, C. S., Cheng, Y. K., Chang, J., Yuan, L., Lin, C. K., Chen, C. C., Yeo, Y. C., Tsai, M. H., Chen, Y. M., Lin, H. T., Chui, C. O., Huang, K. B., Chang, W., Lin, H. J., Chen, K. W., Chen, R., Sun, S. H., Fu, Q., Yang, H. T., Shang, H. L., Chiang, H. T., Yeh, C. C., Lee, T. L., Wang, C. H., Shue, S. L., Wu, C. W., Lu, R., Lin, W. R., Wu, J., Lai, F., Wang, P. W., Wu, Y. H., Tien, B. Z., Huang, Y. C., Lu, L. C., He, Jun, Ku, Y., Lin, J., Cao, M., Chang, T. S., Jang, S. M., Lin, H. C., Peng, Y. C., Sheu, J. Y., Wang, M.
Published in 2019 IEEE International Electron Devices Meeting (IEDM) (01.12.2019)
Published in 2019 IEEE International Electron Devices Meeting (IEDM) (01.12.2019)
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Conference Proceeding
Selective co growth on Cu for void-free via fill
Jun-Fei Zheng, Chen, Philip, Baum, Tomas H., Lieten, Ruben R., Hunks, William, Lippy, Steven, Frye, Asa, Weimin Li, O'Neill, James, Xu, Jeff, Zhu, John, Bao, Jerry, Machkaoutsan, Vladimir, Badaroglu, Mustafa, Yeap, Geoffrey, Murdoch, Gayle, Bommels, Jurgen, Tokei, Zsolt
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)
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Conference Proceeding
28nm LP SoC new product bring-up for smart mobile devices
Yan Sun, Jun Yuan, Hao Wang, Chien-Liang Chen, Leo Kim, Kim, Jay, Yeap, Geoffrey
Published in 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2014)
Published in 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2014)
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Conference Proceeding
Transistor-interconnect mobile system-on-chip co-design method for holistic battery energy minimization
Mojumder, N. N., Song, S. C., Rim, K., Xu, J., Wang, J., Zhu, J., Vratonjic, M., Lin, K., Saint-Laurent, M., Bassett, P., Yeap, Geoffrey
Published in 2015 Symposium on VLSI Circuits (VLSI Circuits) (01.06.2015)
Published in 2015 Symposium on VLSI Circuits (VLSI Circuits) (01.06.2015)
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Conference Proceeding
Journal Article
High performance partially depleted SOI using spike RTA
Kang, Grudowski, Veer Dhandapani, Yongjoo Jeon, Goktepeli, Byoung Min, Yeap, Foisy, Anderson, Mendicino, Venkatesan
Published in 2003 IEEE International Conference on SOI (2003)
Published in 2003 IEEE International Conference on SOI (2003)
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Conference Proceeding
BSIM4-based lateral diode model for RF ESD applications
Ming-Ta Yang, Yang Du, Teng, Charles, Chang, Tony, Worley, Eugene, Ken Liao, You-Wen Yau, Yeap, Geoffrey
Published in 2010 IEEE 11th Annual Wireless and Microwave Technology Conference (WAMICON) (01.04.2010)
Published in 2010 IEEE 11th Annual Wireless and Microwave Technology Conference (WAMICON) (01.04.2010)
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Conference Proceeding
BSIM4-based lateral diode model for LNA co-designed with ESD protection circuit
Ming-Ta Yang, Yang Du, Teng, Charles, Chang, Tony, Worley, Eugene, Liao, Ken, You-Wen Yau, Yeap, Geoffrey
Published in 2010 11th International Symposium on Quality Electronic Design (ISQED) (01.03.2010)
Published in 2010 11th International Symposium on Quality Electronic Design (ISQED) (01.03.2010)
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Conference Proceeding
Cost effective 28nm LP SoC technology optimized with circuit/device/process co-design for smart mobile devices
Chidambaram, P R, Gan, C, Sengupta, S, Ge, L, Chen, Y, Yang, S, Liu, P, Wang, J, Yang, M, Teng, C, Du, Y, Patel, P, Kamal, P, Bucki, R, Vang, F, Datta, A, Bellur, K, Yoon, S, Chen, N, Thean, A, Han, M, Terzioglu, E, Zhang, X, Fischer, J, Sani, M, Flederbach, B, Yeap, G
Published in 2010 International Electron Devices Meeting (01.12.2010)
Published in 2010 International Electron Devices Meeting (01.12.2010)
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Conference Proceeding
Integrated circuit device and method therefor
JALLEPALLI, SRINIVAS, JEON, YONGJOO, BURNETT, JAMES DAVID, YEAP, GEOFFREY C-F, SINGH, RANA P.
Year of Publication 21.06.2007
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Year of Publication 21.06.2007
Patent
Integrated circuit device and method therefor
YEAP GEOFFREY C, JALLEPALLI SRINIVAS, BURNETT JAMES D, SINGH RANA P, GRUDOWSKI PAUL A, JEON YONGJOO
Year of Publication 21.07.2005
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Year of Publication 21.07.2005
Patent