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"GENZ, OLIVER"
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"GENZ, OLIVER"
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Lowering desorption of hydrogen bromide, e.g. during manufacture of semiconductor silicon wafers, involves exposing hydrogen bromide-loaded workpiece to water vapor stream
by
GENZ
,
OLIVER
Year of Publication
15.02.2007
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Dry-etching silicon-containing substrates, especially wafers for semiconductor elements, contains silicon component, e.g. silane, to form side-wall passivation layer
by
GENZ
,
OLIVER
Year of Publication
11.01.2007
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COLUMN PACKING APPARATUS AND METHOD OF MAKING AND USING THE SAME
by
GENZ
,
OLIVER
,
SAARJOCHEN
,
MAIER-ROSENKRANZJUERGEN T
Year of Publication
02.12.2015
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Etching of tungsten involves using a gas mixture that contains nitrogen trifluoride, hydrogen bromide, and oxygen
by
GENZ
,
OLIVER
Year of Publication
21.07.2005
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Column packing apparatus and method of making and using the same
by
MAIER-ROSENKRANZ JUERGEN
,
GENZ OLIVER
,
SAAR JOCHEN
Year of Publication
25.06.2013
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Column packing apparatus and method of making and using the same
by
GENZ OLIVER
,
SAAR JOCHEN
,
MAIER-ROSENKRANZ JUERGEN T
Year of Publication
25.03.2015
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Column Packing Apparatus and Method of Making and Using the Same
by
MAIER-ROSENKRANZ JUERGEN
,
GENZ OLIVER
,
SAAR JOCHEN
Year of Publication
12.04.2012
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Method for introducing structures which have different dimensions into a substrate
by
Baier, Ulrich
,
Genz
,
Oliver
Year of Publication
23.05.2006
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Method for introducing structures which have different dimensions into a substrate
by
GENZ OLIVER
,
BAIER ULRICH
Year of Publication
23.05.2006
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Forming a pattern on a semiconductor substrate layer comprises applying a photosensitive resist to the substrate, exposing the resist and heating
by
GENZ
,
OLIVER
,
MOELLER, HOLGER
Year of Publication
20.04.2006
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Forming a pattern on a semiconductor substrate layer comprises applying a photosensitive resist to the substrate, exposing the resist and heating
by
GENZ
,
OLIVER
,
MOELLER, HOLGER
Year of Publication
08.12.2005
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Semiconductor surface structure examination method, whereby the surface is illuminated with electromagnetic radiation and a characteristic parameter determined from the reflected radiation and compared with a reference value
by
GENZ
,
OLIVER
,
MANTZ, ULRICH
Year of Publication
14.04.2005
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COLUMN PACKING APPARATUS AND METHOD OF MAKING AND USING THE SAME
by
GENZ
,
OLIVER
,
MAIER-ROSENKRANZ, JUERGEN T
,
SAARJOCHEN
Year of Publication
03.11.2010
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Method for introducing structures which have different dimensions into a substrate
by
GENZ OLIVER
,
BAIER ULRICH
Year of Publication
30.09.2004
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Method for introducing structures which have different dimensions into a substrate
by
Genz
,
Oliver
,
Baier, Ulrich
Year of Publication
30.09.2004
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Inserting structures into a substrate used in VLSI technology comprises applying a photo-sensitive layer on an uppermost layer, forming structures on the photo-sensitive layer
by
GENZ
,
OLIVER
,
BAIER, ULRICH
Year of Publication
26.08.2004
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Resin mask manufacturing method for semiconductor technology uses auxiliary layer formed with trough for provision of step in mask layer for obtaining edge region of greater height than central region
by
GENZ
,
OLIVER
,
STAVREV, MOMTCHIL
Year of Publication
12.08.2004
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Production of semiconductor structure using anisotropically structured spacer layer with side wall spacers useful in semiconductor technology
by
GENZ
,
OLIVER
,
WEGE, STEPHAN
Year of Publication
22.07.2004
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Method for removing carbon-containing polysilane from a semiconductor without stripping
by
Lu, Zhijian
,
Genz
,
Oliver
Year of Publication
25.05.2004
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COLUMN PACKING APPARATUS AND METHOD OF MAKING AND USING THE SAME
by
GENZ
,
OLIVER
,
MAIER-ROSENKRANZ, JUERGEN T
,
SAARJOCHEN
Year of Publication
22.10.2009
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