Dynamic Testing and Simulation of Chassis Attached Remote Modular Heat Sink
Geng, Phil, Wang, Ligang, Alonso, Francisco Colorado, Pei, Min, Wang, Chuanlou Felix, He, John, Chuang, Jimmy, Liu, Roger, Miele, Ralph V., Saha, Sanjoy K., Smalley, Jeffory L., Gupta, Ashish
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding
LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DAMAGE
Raghavan, Prasanna, Saha, Sanjoy, Geng, Phil, Bicen, Baris, Xiao, Kai
Year of Publication 24.10.2024
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Year of Publication 24.10.2024
Patent
Cold plate architecture for liquid cooling of devices
Prabhugoud, Mohanraj, Shia, David, Elenitoba-Johnson, Olaotan, Jahne, Craig, Yang, Jin, Geng, Phil
Year of Publication 29.10.2024
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Year of Publication 29.10.2024
Patent
Alternative lead-free solder joint integrity under room temperature mechanical load
Phil Geng, Aspandiar, R., Byrne, T., Pon, F., Daewoong Suh, McAllister, A., Nazario, A., Paulraj, P., Armendariz, N., Martin, T., Worley, T.
Published in The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) (2004)
Published in The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) (2004)
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Conference Proceeding
SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS
Enriquez Shibayama, Raul, Lizalde Moreno, Carlos Alberto, Geng, Phil, Klein, Steven A, Xiao, Kai
Year of Publication 04.04.2024
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Year of Publication 04.04.2024
Patent