Thermal shock behaviors of W/Cu joints with different structures
Wei, Bangzheng, Chen, Ruizhi, Xu, Dang, Li, Gemin, Yang, Guang, Wang, Bing, Chen, Pengqi, Xu, Qiu, Cheng, Jigui
Published in Journal of alloys and compounds (10.12.2023)
Published in Journal of alloys and compounds (10.12.2023)
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Journal Article
Simulation and Analysis to Minimize Audio Noise in System Design
Xue, Mingfeng, Ding, Yao, Leung, Benjamin, Li, Gemin, Zhang, Jianmin
Published in 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01.08.2022)
Published in 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01.08.2022)
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Conference Proceeding
Printed circuit board assembly having a damping layer
Li, Gemin, Yoo, Sung Woo, Duke, Connor R, Gong, Zhong-Qing, Richardson, Kevin R, Bard, Benjamin A, Martinez, Paul, Kottke, Nelson J, Mead, Curtis C, Poulain, Kieran
Year of Publication 01.10.2019
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Year of Publication 01.10.2019
Patent
STACKED PASSIVE COMPONENT STRUCTURES
Arnold Shawn X, Li Gemin, Choi Won Seop, Rainer Amanda R, Ning Gang, Gong Zhong-Qing, Martinez Paul A
Year of Publication 01.03.2018
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Year of Publication 01.03.2018
Patent
PRINTED CIRCUIT BOARD ASSEMBLY HAVING A DAMPING LAYER
Li Gemin, Bard Benjamin A, Mead Curtis C, Poulain Kieran, Gong Zhong-Qing, Richardson Kevin R, Martinez Paul, Duke Connor R, Kottke Nelson J, Yoo Sung Woo
Year of Publication 02.03.2017
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Year of Publication 02.03.2017
Patent
Printed Circuit Board Assembly Having A Damping Layer
CURTIS C. MEAD, ZHONG-QING GONG, BENJAMIN A. BARD, SUNG WOO YOO, KEVI R. RICHARDSON, GEMIN LI, NELSON J. KOTTKE, PAUL MARTINEZ, CONNOR R. DUKE, KIERAN POULAIN
Year of Publication 08.03.2017
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Year of Publication 08.03.2017
Patent