Search Results - "GELORME, JEFFREY" :: K.UTB vyhledávací portál

Loading…

강성 입자들을 포함하는 열 계면 물질로 층들을 열적으로 연결하기 위한 방법, 장치, 및 어셈블리

by SINGH VIVEK, KERR ALLYSSA, GELORME JEFFREY, MAJIDI CARMEL, KAZEM NAVID
Year of Publication 29.12.2023

Get full text

Patent

Loading…

SILANE COUPLING AGENTS FOR PRINTED CIRCUIT BOARDS

by KUCZYNSKI JOSEPH, GELORME JEFFREY DONALD
Year of Publication 07.11.2011

Get full text

Patent

Loading…

Negative photoresists for optical lithography

by Shaw, Jane M, Gelorme, Jeffrey D, LaBianca, Nancy C, Conley, Will E, Holmes, Steven J
Published in IBM journal of research and development (01.01.1997)

Get full text

Journal Article

Loading…

METHOD OF MANUFACTURE OF A THERMAL INTERFACE MATERIAL, A THERMAL INTERFACE MATERIAL FORMED THEREFROM, AND AN INTEGRATED CIRCUIT FORMED THEREFROM

by Kerr, Allyssa, Gelorme, Jeffrey, Kazem, Navid, Feller, Keyton D
Year of Publication 18.07.2024

Get full text

Patent

Loading…

A METHOD, APPARATUS, AND ASSEMBLY FOR THERMALLY CONNECTING LAYERS WITH THERMAL INTERFACE MATERIALS COMPRISING RIGID PARTICLES

by Majidi, Carmel, Kerr, Allyssa, Singh, Vivek, Gelorme, Jeffrey, Kazem, Navid
Year of Publication 27.06.2024

Get full text

Patent

Loading…

A METHOD, APPARATUS, AND ASSEMBLY FOR THERMALLY CONNECTING LAYERS WITH THERMAL INTERFACE MATERIALS COMPRISING RIGID PARTICLES

by KAZEM, Navid, GELORME, Jeffrey, MAJIDI, Carmel, SINGH, Vivek, KERR, Allyssa
Year of Publication 07.02.2024

Get full text

Patent

Loading…

A THERMAL INTERFACE MATERIAL, AN INTEGRATED CIRCUIT ASSEMBLY, AND A METHOD FOR THERMALLY CONNECTING LAYERS

by KAZEM, Navid, GELORME, Jeffrey, MAJIDI, Carmel, SINGH, Vivek
Year of Publication 24.08.2023

Get full text

Patent

Loading…

Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding

by Dang, Bing, Knickerbocker, John U, Gelorme, Jeffrey D
Year of Publication 07.02.2023

Get full text

Patent

Loading…

THERMAL INTERFACE MATERIALS COMPRISING FUNCTIONALIZED LIQUID METAL DROPLETS, CIRCUIT ASSEMBLIES FORMED THEREFROM, AND METHODS OF MANUFACTURE THEREOF

by FELLER, Keyton D, KAZEM, Navid, GELORME, Jeffrey, MEA, Hing Jii, SHAH, Dylan S
Year of Publication 12.09.2024

Get full text

Patent

Loading…

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT ASSEMBLY AND AN INTEGRATED CIRCUIT FORMED THEREFROM

by Shah, Dylan S, Mea, Hing Jii, Gelorme, Jeffrey, Kazem, Navid, Feller, Keyton D
Year of Publication 20.06.2024

Get full text

Patent

Loading…

A METHOD, APPARATUS, AND ASSEMBLY FOR THERMALLY CONNECTING LAYERS WITH THERMAL INTERFACE MATERIALS COMPRISING RIGID PARTICLES

by KAZEM, Navid, GELORME, Jeffrey, MAJIDI, Carmel, SINGH, Vivek, KERR, Allyssa
Year of Publication 29.09.2022

Get full text

Patent

Loading…

Mixing, rheology, and stability of highly filled thermal pastes

by Feger, C, Gelorme, J D, McGlashan-Powell, M, Kalyon, D M
Published in IBM journal of research and development (01.07.2005)

Get full text

Journal Article

Loading…

IR assisted fan-out wafer level packaging using silicon handler

by Dang, Bing, Knickerbocker, John U, Gelorme, Jeffrey D
Year of Publication 31.05.2022

Get full text

Patent

Loading…

Wearable Stacked Strain Gauge Sensor for Monitoring

by Sakuma, Katsuyuki, Gelorme, Jeffrey D, Agno, Marlon
Year of Publication 23.04.2020

Get full text

Patent

Loading…

A THERMAL INTERFACE MATERIAL, AN INTEGRATED CIRCUIT FORMED THEREWITH, AND A METHOD OF APPLICATION THEREOF

by FELLER, Keyton D, KAZEM, Navid, GELORME, Jeffrey, SINGH, Vivek, MEA, Hing Jii, KERR, Allyssa, SHAH, Dylan S
Year of Publication 08.08.2024

Get full text

Patent

Loading…

Thermal interface material, an integrated circuit formed therewith, and a method of application thereof

by Shah, Dylan S, Mea, Hing Jii, Kerr, Allyssa, Gelorme, Jeffrey, Singh, Vivek, Kazem, Navid, Feller, Keyton D
Year of Publication 02.07.2024

Get full text

Patent

Loading…

Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding

by Dang, Bing, Knickerbocker, John U, Gelorme, Jeffrey D
Year of Publication 04.05.2021

Get full text

Patent

Loading…

Wafer level integration including design/co-design, structure process, equipment stress management and thermal management

by Gelorme, Jeffrey, Knickerbocker, John U, Hung, Li-Wen
Year of Publication 12.05.2020

Get full text

Patent

Loading…

IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER

by Dang, Bing, Knickerbocker, John U, Gelorme, Jeffrey D
Year of Publication 26.03.2020

Get full text

Patent

Loading…

THERMOPLASTIC TEMPORARY ADHESIVE FOR SILICON HANDLER WITH INFRA-RED LASER WAFER DE-BONDING

by Dang, Bing, Knickerbocker, John U, Gelorme, Jeffrey D
Year of Publication 12.03.2020

Get full text

Patent

Refine Results

Format

Subject Area

Topic

Language

Year of Publication

Database