METHOD OF FABRICATING HIGH YIELD WAFER LEVEL PACKAGES INTEGRATING MMIC AND MEMS COMPONENTS
CHANGIEN, PATTY, GEIGER, CRAIG, B, KONG, ALVIN, M, TOMQUIST, KELLY, J
Year of Publication 05.03.2008
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Year of Publication 05.03.2008
Patent
METHOD OF FABRICATING HIGH YIELD WAFER LEVEL PACKAGES INTEGRATING MMIC AND MEMS COMPONENTS
CHANGIEN, PATTY, GEIGER, CRAIG, B, KONG, ALVIN, M, TOMQUIST, KELLY, J
Year of Publication 04.01.2007
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Year of Publication 04.01.2007
Patent
Method of fabricating high yield wafer level packages integrating MMIC and MEMS components
Chang-Chien, Patty P, Tomquist, Kelly J, Geiger, Craig B, Kong, Alvin M
Year of Publication 27.06.2006
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Year of Publication 27.06.2006
Patent