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Year of Publication 30.03.2023
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Year of Publication 30.03.2023
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Year of Publication 18.02.2011
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Through-silicon vias enable next-generation SiGe power amplifiers for wireless communications
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Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Year of Publication 29.02.2024
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Year of Publication 28.03.2024
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Year of Publication 07.02.2023
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Efuse inside and gate structure on triple-well region
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Year of Publication 19.12.2023
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Year of Publication 19.12.2023
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NON-PLANAR SILICIDED SEMICONDUCTOR ELECTRICAL FUSE
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Year of Publication 26.05.2022
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Year of Publication 26.05.2022
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Electronic fuse (e-fuse) cells integrated with bipolar device
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Year of Publication 03.05.2022
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Year of Publication 03.05.2022
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EFUSE INSIDE AND GATE STRUCTURE ON TRIPLE-WELL REGION
Gauthier, JR., Robert J, Ginawi, Ahmed Y, Shank, Steven M, Loiseau, Alain F, Abou-Khalil, Michel J, Gebreselasie, Ephrem G
Year of Publication 23.03.2023
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Year of Publication 23.03.2023
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Electrostatic discharge clamp with reduced off-state power consumption
Poro, III, Richard A, Stricker, Andreas D, Ginawi, Ahmed Y, Loiseau, Alain F, Lukaitis, Joseph M, Gebreselasie, Ephrem G
Year of Publication 20.04.2021
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Year of Publication 20.04.2021
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APPARATUS AND METHOD TO PREVENT INTEGRATED CIRCUIT FROM ENTERING LATCH-UP MODE
Chang, Shunhua T, Yu, Mickey H, Muhammad, Mujahid, Lu, Xiangxiang, Gebreselasie, Ephrem G
Year of Publication 30.04.2020
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Year of Publication 30.04.2020
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Apparatus and method to prevent integrated circuit from entering latch-up mode
Chang, Shunhua T, Yu, Mickey H, Muhammad, Mujahid, Lu, Xiangxiang, Gebreselasie, Ephrem G
Year of Publication 28.04.2020
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Year of Publication 28.04.2020
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