STACKED DIE ASSEMBLY INCLUDING DUAL-SIDED INTER-DIE BONDING CONNECTION
RAJASHEKHAR, ASHOK, ZHOU FEI, CHIBWENGOEZE, HERV, CUI ZHIXIN, GAUTAM RISHAD, MAKALA RAGHUVEER S, SHARAMPANI, RAVI
Year of Publication 29.07.2022
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Year of Publication 29.07.2022
Patent