Wafer-level fan-out packaging structure and preparation method thereof
GAO SIZHENG, JIANG CHENHAO, SHI-HUANG JUNYUAN, LIU ZHANWEN, PANG HONGLIN
Year of Publication 21.07.2023
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Year of Publication 21.07.2023
Patent
Multi-chip embedded fan-out packaging structure and preparation method thereof
GAO SIZHENG, HUANG SENHUI, SHI-HUANG JUNYUAN, LIU ZHANWEN, PANG HONGLIN
Year of Publication 21.07.2023
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Year of Publication 21.07.2023
Patent