Improved QFN Reliability by flank tin plating process after singulation
Ganjei, John
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
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Conference Proceeding
Enabling MSL-1 capability for QFN and other design leadframe packages
Hart, Dan, Ganjei, John, Kapadia, Nilesh
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
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Conference Proceeding
Thermal characterization of a printed circuit board with thermal vias for the application of high brightness light-emitting diodes
Mian Tao, Zicheng Feng, Swanson, John, Ganjei, John, Lo, Jeffery C. C., Lee, S. W. Ricky
Published in 2013 10th China International Forum on Solid State Lighting (ChinaSSL) (01.11.2013)
Published in 2013 10th China International Forum on Solid State Lighting (ChinaSSL) (01.11.2013)
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Conference Proceeding
Journal Article
Increasing IC Leadframe Package Reliability
Hart, D., Lee, B., Ganjei, J.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Digital Inkjet Printing for Etching Circuits: Putting the Pieces in Place for Printed PCBs
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Trade Publication Article