WAFER ELECTROPLATING APPARATUS FOR REDUCING EDGE DEFECTS
GANESAN KOUSIK, HE ZHIAN, BUCKALEW BRYAN L, TAKADA YUICHI, PRABHAKAR VINAY, MAYER STEVEN T, REID JONATHAN D, GHONGADI SHANTINATH, ZIBRIDA JAMES R, RASH ROBERT
Year of Publication 18.06.2010
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Year of Publication 18.06.2010
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INTEGRATED CIRCUIT SUBSTRATE AND METHOD OF MAKING
Pietambaram, Srinivas, Wall, Marcel Arlan, Ganesan, Kousik, Manepalli, Rahul N
Year of Publication 02.07.2020
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Year of Publication 02.07.2020
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Integrated circuit substrate and method of making
Pietambaram, Srinivas, Wall, Marcel Arlan, Ganesan, Kousik, Manepalli, Rahul N
Year of Publication 19.05.2020
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Year of Publication 19.05.2020
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INTEGRATED CIRCUIT SUBSTRATE AND METHOD OF MAKING
Pietambaram, Srinivas, Wall, Marcel Arlan, Ganesan, Kousik, Manepalli, Rahul N
Year of Publication 04.04.2019
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Year of Publication 04.04.2019
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INTEGRATED CIRCUIT SUBSTRATE AND METHOD OF MAKING
GANESAN, Kousik, WALL, Marcel Arlan, PIETAMBARAM, Srinivas, MANEPALLI, Rahul N
Year of Publication 03.04.2019
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Year of Publication 03.04.2019
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Innovative Advances in Copper Electroplating for IC Substrate Manufacturing
Ganesan, Kousik, Yang Sun, Pendyala, Chandrasekhar, Chalupa, Radek, Nad, Suddhastawa, Heaton, Thomas, Wall, Marcel, Manepalli, Rahul, Tasooji, Amaneh
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Via Superfill with Time Pulse Plating in a Dual Couple Redox System
Nad, Suddhasattwa, Sun, Yang, Chalupa, Radek, Pendyala, Chandrashekhar, Ganesan, Kousik
Published in Meeting abstracts (Electrochemical Society) (05.08.2014)
Published in Meeting abstracts (Electrochemical Society) (05.08.2014)
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Journal Article
MICROELECTRONIC DEVICE INTERCONNECT STRUCTURE
Alur, Amruthavalli Pallavi, Ganesan, Kousik, Chavali, Sri Chaitra Jyotsna, Heaton, Thomas, Dubey, Manish, Nad, Suddhasattwa
Year of Publication 02.01.2020
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Year of Publication 02.01.2020
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MICROELECTRONIC DEVICE INTERCONNECT STRUCTURE
CHAVALI, Sri Chaitra Jyotsna, GANESAN, Kousik, HEATON, Thomas, ALUR, Amruthavalli Pallavi, NAD, Suddhasattwa, DUBEY, Manish
Year of Publication 02.01.2020
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Year of Publication 02.01.2020
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Apparatus and method for edge bevel removal of copper from silicon wafers
Ghongadi Shantinath, Majid Tariq, Ganesan Kousik, Labrie Aaron, Mayer Steven T
Year of Publication 20.06.2017
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Year of Publication 20.06.2017
Patent