Study of Accelerated Aging of Supercapacitors for Transport Applications
Hammar, A, Venet, P, Lallemand, R, Coquery, G, Rojat, G
Published in IEEE transactions on industrial electronics (1982) (01.12.2010)
Published in IEEE transactions on industrial electronics (1982) (01.12.2010)
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Journal Article
Investigation of the heel crack mechanism in Al connections for power electronics modules
Celnikier, Y., Benabou, L., Dupont, L., Coquery, G.
Published in Microelectronics and reliability (01.05.2011)
Published in Microelectronics and reliability (01.05.2011)
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Journal Article
Power module thermal cycling tester for in-situ ageing detection
Pougnet, Ph, Coquery, G., Lallemand, R., Makhloufi, A.
Published in Microelectronics and reliability (01.09.2017)
Published in Microelectronics and reliability (01.09.2017)
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Journal Article
A framework for the probabilistic analysis of PEMFC performance based on multi-physical modelling, stochastic method, and design of numerical experiments
Noguer, N., Candusso, D., Kouta, R., Harel, F., Charon, W., Coquery, G.
Published in International journal of hydrogen energy (05.01.2017)
Published in International journal of hydrogen energy (05.01.2017)
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Journal Article
Description of supercapacitor performance degradation rate during thermal cycling under constant voltage ageing test
Ayadi, M., Briat, O., Lallemand, R., Eddahech, A., German, R., Coquery, G., Vinassa, J.M
Published in Microelectronics and reliability (01.09.2014)
Published in Microelectronics and reliability (01.09.2014)
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Journal Article
Conference Proceeding
Thermal cycling impacts on supercapacitor performances during calendar ageing
Ayadi, M., Briat, O., Eddahech, A., German, R., Coquery, G., Vinassa, J.M.
Published in Microelectronics and reliability (01.09.2013)
Published in Microelectronics and reliability (01.09.2013)
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Journal Article
Conference Proceeding
Optimization of wire connections design for power electronics
Celnikier, Y., Dupont, L., Hervé, E., Coquery, G., Benabou, L.
Published in Microelectronics and reliability (01.09.2011)
Published in Microelectronics and reliability (01.09.2011)
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Journal Article
Conference Proceeding
Characterisation and modelling of a 5 kW PEMFC for transportation applications
Candusso, D., Harel, F., De Bernardinis, A., François, X., Péra, M.C., Hissel, D., Schott, P., Coquery, G., Kauffmann, J.-M.
Published in International journal of hydrogen energy (01.07.2006)
Published in International journal of hydrogen energy (01.07.2006)
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Journal Article
Multi-port power converter for segmented PEM fuel cell in transport application
De Bernardinis, A., Frappé, E., Béthoux, O., Marchand, C., Coquery, G.
Published in European physical journal. Applied physics (01.05.2012)
Published in European physical journal. Applied physics (01.05.2012)
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Journal Article
Accelerated active ageing test on SiC JFETs power module with silver joining technology for high temperature application
Dupont, L., Coquery, G., Kriegel, K., Melkonyan, A.
Published in Microelectronics and reliability (01.09.2009)
Published in Microelectronics and reliability (01.09.2009)
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Journal Article
Conference Proceeding
PEM fuel cell fault detection and identification using differential method: simulation and experimental validation
Frappé, E., De Bernardinis, A., Bethoux, O., Candusso, D., Harel, F., Marchand, C., Coquery, G.
Published in European physical journal. Applied physics (01.05.2011)
Published in European physical journal. Applied physics (01.05.2011)
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Journal Article
Experimental and numerical results correlation during extreme use of power MOSFET designed for avalanche functional mode
Dupont, L., Blanchard, J.L., Lallemand, R., Coquery, G., Morelle, J.M., Blondel, G., Rouleau, B.
Published in Microelectronics and reliability (01.09.2010)
Published in Microelectronics and reliability (01.09.2010)
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Journal Article
Conference Proceeding
Thermo-mechanical assessment of silver sintering for attaching power components in embedded PCB
Arabi, F., Youssef, T., Coudert, M., Coquery, G., Alayli, N., Martineau, D., Belnoue, O.
Published in Microelectronics and reliability (01.11.2020)
Published in Microelectronics and reliability (01.11.2020)
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Journal Article
Temperature measurements and thermal modeling of high power IGBT multichip modules for reliability investigations in traction applications
Hamidi, A., Coquery, G., Lallemand, R., Vales, P., Dorkel, J.M.
Published in Microelectronics and reliability (01.06.1998)
Published in Microelectronics and reliability (01.06.1998)
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Conference Proceeding
Effects of current density and chip temperature distribution on lifetime of high power IGBT modules in traction working conditions
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Journal Article
Conference Proceeding
Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter
Coquery, G., Carubelli, S., Ousten, J.P., Lallemand, R., Lecoq, F., Lhotellier, D., de Viry, V., Dupuy, Ph
Published in Microelectronics and reliability (01.09.2001)
Published in Microelectronics and reliability (01.09.2001)
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