Delamination and solder flow-out in underfilled and Pb-free flip chips on laminate
van Kleef, Marc, Bielen, Jeroen, Gülpen, Jan, Ramos, Mike
Published in Microelectronics international (01.08.2005)
Published in Microelectronics international (01.08.2005)
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Journal Article
Reactions of Rh- and Ir-bis(iminophosphoranyl)methanide compounds with electrophiles; a trapped cation-anion complex in the oxidative addition of iodine to a d8 metal centre and X-ray crystal structure of IrI{CH(PPh2NC6H4CH3-4)2}(COD)]I, containing two fused four-membered metallacycles
Imhoff, Pieter, Gülpen, Jan H., Vrieze, Kees, Smeets, Wilberth J.J., Spek, Anthony L., Elsevier, Cornelis J.
Published in Inorganica Chimica Acta (01.07.1995)
Published in Inorganica Chimica Acta (01.07.1995)
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Journal Article
Reactions of Rh- and Ir-bis(iminophosphoranyl)methanide compounds with electrophiles; a trapped cation-anion complex in the oxidative addition of iodine to a d 8 metal centre and X-ray crystal structure of IrI{CH(PPh 2NC 6H 4CH 3-4) 2}(COD)]I, containing two fused four-membered metallacycles
Imhoff, Pieter, Gülpen, Jan H., Vrieze, Kees, Smeets, Wilberth J.J., Spek, Anthony L., Elsevier, Cornelis J.
Published in Inorganica Chimica Acta (1995)
Published in Inorganica Chimica Acta (1995)
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Journal Article
Growth of Silicides in Ni-Si and Ni-SiC Bulk Diffusion Couples
Gülpen, Jan H., Kodentsov, Alexander A., Loo, Frans J. J. van
Published in International journal of materials research (01.08.1995)
Published in International journal of materials research (01.08.1995)
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Journal Article