Electrodeposition of ZnO from Acetate Bath for Thermoelectric Devices
Matsuo, Hinako, Yoshitoku, Koichiro, Furuyama, Daiki, Saito, Mikiko, Homma, Takayuki
Published in ECS transactions (10.01.2017)
Published in ECS transactions (10.01.2017)
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Journal Article
Study for Cu-Cu Bonding Technology by Nanoporous Cu Structure
FURUYAMA, Daiki, INOUE, Junta, NAKAGAWA, Takuma, TATSUMI, Koji, NAKAGAWA, Sho, KATASE, Takuma
Published in Journal of Smart Processing (10.09.2022)
Published in Journal of Smart Processing (10.09.2022)
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Journal Article
Investigation of Cu-Cu Direct Bonding Process Utilized by High Porosity and Nanocrystal Structure
Nakagawa, Takuma, Furuyama, Daiki, Nakagawa, Sho, Mori, Yutaro, Iwata, Kotaro, Nakaya, Kiyotaka, Katase, Takuma
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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