Packaging design of the IBM System z10 Enterprise Class platform central electronic complex
Torok, J G, Bosco, F E, Brodsky, W L, Furey, E F, Goth, G F, Kearney, D J, Loparco, J J, Peets, M T, Pizzolato, K L, Porter, D W, Ruehle, G, White, W H
Published in IBM journal of research and development (01.01.2009)
Published in IBM journal of research and development (01.01.2009)
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