On the intermetallic corrosion of Cu-Al wire bonds
Boettcher, Tim, Rother, Michael, Liedtke, Stefan, Ullrich, Mandy, Bollmann, Marc, Pinkernelle, Andreas, Gruber, Daniel, Funke, Hans-Juergen, Kaiser, Michael, Kan Lee, Li, Martin, Leung, Karina, Li, Tina, Farrugia, Mark Luke, O'Halloran, Orla, Petzold, Matthias, März, Benjamin, Klengel, Robert
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
CHIP-SCALE PACKAGE
BUENNING HARTMUT, POELMA REGNERUS HERMANNUS, KUIPERS JOHANNES JOSINUS, FUNKE HANS JUERGEN, BERGLUND STEFAN, STOKKERMANS JOEP, SCHNITT WOLFGANG
Year of Publication 21.07.2023
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Year of Publication 21.07.2023
Patent
Optimization of Epoxy Molding Compound for Cu wire HTRB Robustness
Garete, April Joy, Li, Zhiwen, Bi, Billie Xianghong, Funke, Hans-Juergen, Lee, Kwong Cheung, Chen, Haibin
Published in 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21.12.2021)
Published in 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21.12.2021)
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Conference Proceeding
Evaluation on Wedge Bond Performance of Different Cu Wire Types during Thermal Cycling Test (IMPACT 2020)
Bi, Billie Xianghong, Funke, Hans-Juergen, Lam, Wai, Chen, Haibin
Published in 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21.10.2020)
Published in 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21.10.2020)
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Conference Proceeding
Characteristics and Reliability of Al and Al-coated Cu Wires for High Power Applications
Flauta, Randolph, Juergen-Funke, Hans, Birkoben, Tom, Habenict, Sonke, Liguda, Christian, Tai, King Man, Fan, Haibo, Yao, Peilun, Chen, Haibin
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
CHIP-SCALE PACKAGED VERTICAL SEMICONDUCTOR DEVICE
Funke, Hans-Juergen, Kuipers, Johannes Josinus, Poelma, Rene, Bünning, Hartmut, Berglund, Stefan, Schnitt, Wolfgang, Stokkermans, Joep
Year of Publication 19.07.2023
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Year of Publication 19.07.2023
Patent
Method of Manufacturing a Semiconductor Package, Such Semiconductor Package as well as an Electronic System Comprising a PCB Element and at Least Such Semiconductor Package
Poelma, Regnerus Hermannus, Böttcher, Tim, Funke, Hans-Juergen, Wong, Wai Man, Chan, Chun Ning, Entringer, Jannik, Cheung, Yuet Keung
Year of Publication 11.04.2024
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Year of Publication 11.04.2024
Patent
A METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE, SUCH SEMICONDUCTOR PACKAGE AS WELL AS AN ELECTRONIC SYSTEM COMPRISING A PCB ELEMENT AND AT LEAST SUCH SEMICONDUCTOR PACKAGE
Poelma, Regnerus Hermannus, Böttcher, Tim, Funke, Hans-Juergen, Wong, Wai Man, Chan, Chun Ning, Entringer, Jannik, Cheung, Yuet Keung
Year of Publication 10.04.2024
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Year of Publication 10.04.2024
Patent
CHIP-SCALE PACKAGE
Poelma, Regnerus Hermannus, Funke, Hans-Juergen, Kuipers, Johannes Josinus, Bünning, Hartmut, Berglund, Stefan, Schnitt, Wolfgang, Stokkermans, Joep
Year of Publication 08.11.2023
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Year of Publication 08.11.2023
Patent
CHIP-SCALE PACKAGE
Poelma, Regnerus Hermannus, Funke, Hans-Juergen, Kuipers, Johannes Josinus, Bünning, Hartmut, Berglund, Stefan, Schnitt, Wolfgang, Stokkermans, Joep
Year of Publication 20.07.2023
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Year of Publication 20.07.2023
Patent
CHIP-SCALE PACKAGE
Poelma, Regnerus Hermannus, Funke, Hans-Juergen, Kuipers, Johannes Josinus, Bünning, Hartmut, Berglund, Stefan, Schnitt, Wolfgang, Stokkermans, Joep
Year of Publication 19.07.2023
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Year of Publication 19.07.2023
Patent