by Fuller, N.C.M., Worsley, M.A., Tai, L., Bent, S., Labelle, C., Arnold, J., Dalton, T.
Published in Thin solid films (01.04.2008)

by Fuller, N.C.M., Santiago, A., Mello, K., Chienfan Yu, Molis, S.
Published in The 17th Annual SEMI/IEEE ASMC 2006 Conference (2006)

by Fuller, N.C.M., Worsley, M.A., Nitta, S., Dalton, T., Tai, T.L., Bent, S., Magbitang, T., Dubois, G., Miller, R., Volksen, W., Sankar, M., Purushothaman, S.
Published in 2006 International Interconnect Technology Conference (2006)

by Fried, D.M., Hergenrother, J.M., Topol, A.W., Chang, L., Sekaric, L., Sleight, J.W., McNab, S.J., Newbury, J., Steen, S.E., Gibson, G., Zhang, Y., Fuller, N.C.M., Bucchignano, J., Lavoie, C., Cabral Jr, C., Canaperi, D., Dokumaci, O., Frank, D.J., Duch, E.A., Babich, I., Wong, K., Ott, J.A., Adams, C.D., Dalton, T.J., Nunes, R., Medeiros, D.R., Viswanathan, R., Ketchen, M., Ieong, M., Haensch, W., Guarini, K.W.
Published in IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004 (2004)