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Cu添加6063アルミニウム合金の時効挙動に及ぼす溶体化処理温度の影響
by
中村, 貴彦
,
藤山, 真一
,
野口, 雅弘
,
小松, 伸也
,
櫻井, 健夫
Published in
軽金属
(2009)
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Effect of solution treatment temperature on aging behavior of Cu added 6063 aluminum alloy
by
Nakamura, Takahiko
,
Fujiyama
,
Shin
-
ichi
,
Noguchi, Masahiro
,
Komatsu, Shin-ya
,
Sakurai, Takeo
Published in
Journal of Japan Institute of Light Metals
(01.03.2009)
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Journal Article
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engineering
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Topic
6063 aluminum alloys
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aging behavior
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cu addition
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hardness
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resistivity
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solution treatment temperature
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Japanese
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