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Design and performance evaluation of microprocessor packaging capacitors using integrated capacitor-via-plane model
by
Yuan-Liang Li
,
Teong-Guang Yew
,
Chee Yee Chung
,
Fugueroa
,
D.G
.
Published in
IEEE transactions on advanced packaging
(01.08.2000)
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Journal Article
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applied sciences
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engineering
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applied sciences
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capacitor
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capacitors
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clocks
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computer-aided design of microcircuits; layout and modeling
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decoupling
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English
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IEEE Xplore
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