Search Results - "Fuergut Edward" :: K.UTB vyhledávací portál

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MEMS DEVICE

by THEUSS HORST, FUERGUT EDWARD
Year of Publication 09.03.2015

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PACKAGED MEMS DEVICE

by FUERGUT EDWARD, ESCHER POEPPEL IRMGARD, DEHE ALFONS
Year of Publication 09.03.2015

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Patent

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SYSTEMS AND METHODS USING AN RF CIRCUIT ON ISOLATING MATERIAL

by AHRENS CARSTEN, MUELLER ANNELIESE, FUERGUT EDWARD, STELTENPOHL ANTON
Year of Publication 02.05.2016

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Patent

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Electrically insulating thermal interface on the discontinuity of an encapsulation structure

by Mengel, Manfred, Fuergut, Edward
Year of Publication 29.06.2021

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Patent

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GATE DRIVER CIRCUIT AND POWER SWITCHING ASSEMBLY WITH GATE DRIVER CIRCUIT

by FUERGUT, Edward, GRASSO, Massimo, MAUDER, Anton
Year of Publication 03.04.2024

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AN ELECTRONIC DEVICE MODULE AND A DEVICE MODULE BOTH WITH INCREASED RELIABILITY DUE TO AN ADHESION PROMOTER LAYER

by FUERGUT, Edward, SCHMOELZER, Bernd, SAX, Harry Walter
Year of Publication 22.11.2023

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Power package having multiple mold compounds

by Fuergut, Edward, Gruber, Martin
Year of Publication 16.06.2020

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Method for fabricating an electronic module via compression molding

by Park, Dae Kuen, Fuergut, Edward
Year of Publication 30.11.2021

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Patent

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Method of forming a semiconductor package with connection lug

by Schmoelzer, Bernd, Fuergut, Edward, Hopfgartner, Herbert, Gruber, Martin
Year of Publication 22.10.2024

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Method for fabricating a semiconductor chip panel

by Porwol, Daniel, Fuergut, Edward
Year of Publication 19.11.2019

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Semiconductor Device Module Comprising Flexible Leads for the Purpose of Height Adjustment

by Schindler, Uwe, Fuergut, Edward, Grassmann, Andreas
Year of Publication 02.02.2023

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Semiconductor Power Module with Two Different Potting Materials and a Method for Fabricating the Same

by Mayer, Martin, Fuergut, Edward, Hartung, Hans
Year of Publication 19.01.2023

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A SEMICONDUCTOR POWER MODULE WITH TWO DIFFERENT POTTING MATERIALS AND A METHOD FOR FABRICATING THE SAME

by FUERGUT, Edward, MAYER, Martin, HARTUNG, Hans
Year of Publication 18.01.2023

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A SEMICONDUCTOR TRANSISTOR PACKAGE COMPRISING ELECTRICAL CONTACT LAYERS AND A METHOD FOR FABRICATING THE SAME

by FUERGUT, Edward, SCHOLZ, Wolfgang, ZUDOCK, Frank, ROTH, Alexander, MEYER, Thorsten
Year of Publication 14.08.2024

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Method for manufacturing an arrangement including a chip carrier notch

by Fuergut, Edward, Ledutke, Michael
Year of Publication 23.07.2019

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AN ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE DISPOSED ON AN INTERPOSER LAYER

by Chiola, Davide, Fuergut, Edward, Gruber, Martin, Hable, Wolfram
Year of Publication 13.06.2024

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Power Package Having Multiple Mold Compounds

by Fuergut, Edward, Gruber, Martin
Year of Publication 23.05.2019

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Stapel aus einem MEMS-Chip und einem Schaltungs-Chip

by Theuss, Horst, Fuergut, Edward
Year of Publication 07.03.2024

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Electronic module including a semiconductor package connected to a fluid heatsink

by Chiola, Davide, Fuergut, Edward, Gruber, Martin, Hable, Wolfram
Year of Publication 09.04.2024

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Molded semiconductor package with dual integrated heat spreaders

by Fuergut, Edward, Joanna Chye, Jo Ean, Otremba, Ralf
Year of Publication 12.03.2024

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Patent

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