Search Results - "Fuergut Edward" :: K.UTB vyhledávací portál

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Electronic Module with Improved Heat Dissipation and Fabrication Thereof

by Park, Dae Kuen, Fuergut, Edward
Year of Publication 20.08.2020

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SEMICONDUCTOR PACKAGE HAVING AT LEAST ONE ELECTRICALLY CONDUCTIVE SPACER AND METHOD OF FORMING THE SEMICONDUCTOR PACKAGE

by Fuergut, Edward, Gruber, Martin, Otremba, Ralf, Escher-Poeppel, Irmgard
Year of Publication 14.12.2023

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MEMS device

by Theuss, Horst, Fuergut, Edward
Year of Publication 13.11.2018

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A METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE WITH INCREASED RELIABILITY AND A SEMICONDUCTOR DEVICE MODULE

by NIKITIN, Ivan, FUERGUT, Edward, SCHMOELZER, Bernd, SCHOLZ, Wolfgang
Year of Publication 08.11.2023

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AN ELECTRONIC MODULE COMPRISING A SEMICONDUCTOR PACKAGE CONNECTED TO A FLUID HEATSINK

by FUERGUT, Edward, GRUBER, Martin, CHIOLA, Davide, HABLE, Wolfram
Year of Publication 08.11.2023

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Anordnung mit mehreren Chips und einem Chipträger und eine Prozessieranordnung

by Fuergut, Edward, Ledutke, Michael
Year of Publication 07.09.2023

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Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement

by Fuergut, Edward, Hoegerl, Juergen
Year of Publication 30.10.2018

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Patent

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A SEMICONDUCTOR PACKAGE AND A SEMICONDUCTOR DEVICE MODULE COMPRISING THE SAME

by NIKITIN, Ivan, FUERGUT, Edward, SCHMOELZER, Bernd, SCHOLZ, Wolfgang, FAELSCHLE, Annette
Year of Publication 13.09.2023

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Semiconductor package with connection lug

by Schmoelzer, Bernd, Fuergut, Edward, Hopfgartner, Herbert, Gruber, Martin
Year of Publication 15.08.2023

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Method for Fabricating a Semiconductor Chip Panel

by Porwol, Daniel, Fuergut, Edward
Year of Publication 09.08.2018

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Semiconductor package with signal distribution element

by Huerner, Andreas, Mauder, Anton, Fuergut, Edward, Gruber, Martin, Voss, Stephan
Year of Publication 08.08.2023

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Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit

by Mahler, Joachim, Hosseini, Khalil, Fuergut, Edward
Year of Publication 30.11.2021

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Semiconductor package and method of forming a semiconductor package

by Fuergut, Edward, Gruber, Martin, Otremba, Ralf, Escher-Poeppel, Irmgard
Year of Publication 01.08.2023

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Method for fabricating a semiconductor chip panel

by Porwol, Daniel, Fuergut, Edward
Year of Publication 24.04.2018

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Electronic devices including electrically insulated load electrodes

by Nikitin, Ivan, Fuergut, Edward, Basler, Thomas, Bayerer, Reinhold
Year of Publication 09.05.2023

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EMBEDDED PACKAGE WITH DELAMINATION MITIGATION

by Schmoelzer, Bernd, Nikitin, Ivan, Fuergut, Edward, Scholz, Wolfgang
Year of Publication 06.04.2023

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Package with electrically insulated carrier and at least one step on encapsulant

by Hong, Chii Shang, Schmoelzer, Bernd, Fuergut, Edward, Tean, Ke Yan, Lee, Teck Sim, Wang, Lee Shuang
Year of Publication 17.09.2024

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Semiconductor device module having vertical metallic contacts and a method for fabricating the same

by Schmoelzer, Bernd, Palm, Petteri, Fuergut, Edward, Gruber, Martin, Scholz, Wolfgang, Thomas, Mark
Year of Publication 03.09.2024

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Semiconductor Device with Improved Performance in Operation and Improved Flexibility in the Arrangement of Power Chips

by Mauder, Anton, Fuergut, Edward, Gruber, Martin, Voss, Stephan
Year of Publication 01.12.2022

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A SEMICONDUCTOR DEVICE WITH IMPROVED PERFORMANCE IN OPERATION AND IMPROVED FLEXIBILITY IN THE ARRANGEMENT OF POWER CHIPS

by FUERGUT, Edward, VOSS, Stephan, GRUBER, Martin, MAUDER, Anton
Year of Publication 30.11.2022

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