Application of TOFSIMS for Contamination Issues in the Assembly World
Pathangey, B., Proctor, A., Zhiyong Wang, Zezhong Fu, Tanikella, R.
Published in IEEE transactions on device and materials reliability (01.03.2007)
Published in IEEE transactions on device and materials reliability (01.03.2007)
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Magazine Article
Materials challenges in interconnection: Trade-offs for rapid deployment
Frutschy, Kris, Fu, Zezhong, Goyal, Deepak, Kinsman, Ken, Samuelson, Gay, Vogt, Ryan
Published in JOM (1989) (01.03.1999)
Published in JOM (1989) (01.03.1999)
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Journal Article
Integrated circuit edge protection method and apparatus
Khaw, Lee Peng, Chong, Kam Meng, Diaz, Diego, Wang, Zhiyong, Fu, Zezhong
Year of Publication 16.03.2010
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Year of Publication 16.03.2010
Patent
Integrated circuit edge protection method and apparatus
Khaw, Lee Peng, Chong, Kam Meng, Diaz, Diego, Wang, Zhiyong, Fu, Zezhong
Year of Publication 13.05.2008
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Year of Publication 13.05.2008
Patent