Impact of Constellation and Index Mapper Selection in OFDM-IM Systems
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Published in 2023 VTS Asia Pacific Wireless Communications Symposium (APWCS) (01.08.2023)
Published in 2023 VTS Asia Pacific Wireless Communications Symposium (APWCS) (01.08.2023)
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Conference Proceeding
RIC-Assisted Smart Microgrid for Renewable Powered Radio Access Network
Cho, Li, Lin, Ching-Po, Li, Chun-Wei, Yang, Tsung-Hao, Fu, Sheng-Hsiang, Hsiao, Chun-Yu
Published in 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) (17.07.2023)
Published in 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) (17.07.2023)
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Conference Proceeding
BER Reduction for PSK-Based MM-OFDM-BIM with Two-Level Symbol Power
Cho, Li, Chuang, Meng-Fan, Fu, Sheng-Hsiang, Hsu, Chau-Yun
Published in 2020 22nd International Conference on Advanced Communication Technology (ICACT) (01.02.2020)
Published in 2020 22nd International Conference on Advanced Communication Technology (ICACT) (01.02.2020)
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Conference Proceeding
Chip package and method for forming the same
Lin, Chao-Yen, Tsai, Wen-Chou, Fang, Ming-Hong, Wang, Jen-Yen, Chen, Chih-Hao, Chiou, Guo-Jyun, Fu, Sheng-Hsiang
Year of Publication 23.10.2012
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Year of Publication 23.10.2012
Patent
Chip package
WANG JEN-YEN, CHIOU GUO-JYUN, FU SHENG-HSIANG, TSAI WENOU, CHEN CHIH-HAO, LIN CHAO-YEN, FANG MING-HONG
Year of Publication 06.05.2015
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Year of Publication 06.05.2015
Patent
Chip package and method for forming the same
WANG JEN-YEN, CHIOU GUO-JYUN, FU SHENG-HSIANG, TSAI WENOU, CHEN CHIH-HAO, LIN CHAO-YEN, FANG MING-HONG
Year of Publication 06.08.2013
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Year of Publication 06.08.2013
Patent
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
WANG JEN-YEN, CHIOU GUO-JYUN, FU SHENG-HSIANG, TSAI WENOU, CHEN CHIH-HAO, LIN CHAO-YEN, FANG MING-HONG
Year of Publication 21.02.2013
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Year of Publication 21.02.2013
Patent
Chip package and method for forming the same
WANG JEN-YEN, CHIOU GUO-JYUN, FU SHENG-HSIANG, TSAI WENOU, CHEN CHIH-HAO, LIN CHAO-YEN, FANG MING-HONG
Year of Publication 23.10.2012
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Year of Publication 23.10.2012
Patent
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
WANG JEN-YEN, CHIOU GUO-JYUN, FU SHENG-HSIANG, TSAI WENOU, CHEN CHIH-HAO, LIN CHAO-YEN, FANG MING-HONG
Year of Publication 18.08.2011
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Year of Publication 18.08.2011
Patent
Chip package
WANG, JEN YEN, CHEN, CHIH HAO, FU, SHENG HSIANG, CHIOU, GUO JYUN, FANG, MING HONG, TSAI, WEN CHOU, LIN, CHAO YEN
Year of Publication 01.12.2015
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Year of Publication 01.12.2015
Patent
Chip package
WANG JEN-YEN, CHIOU GUO-JYUN, FU SHENG-HSIANG, TSAI WENOU, CHEN CHIH-HAO, LIN CHAO-YEN, FANG MING-HONG
Year of Publication 24.08.2011
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Year of Publication 24.08.2011
Patent
Chip package
CHEN, CHIH-HAO, FU, SHENG-HSIANG, CHIOU, GUO-JYUN, FANG, MING-HONG, WANG, JEN-YEN, LIN, CHAO-YEN, TSAI, WENOU
Year of Publication 16.08.2011
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Year of Publication 16.08.2011
Patent