by Zha, L.S., Zhang, Y., Yang, W.L., Fu, S.K.
Published in Advanced materials (Weinheim) (05.08.2002)

by Deng, Y.H., Yang, W.L., Wang, C.C., Fu, S.K.
Published in Advanced materials (Weinheim) (16.10.2003)

by Zha, L.S., Zhang, Y., Yang, W.L., Fu, S.K.
Published in Advanced materials (Weinheim) (05.08.2002)

by Xu, Z.Z, Wang, C.C, Yang, W.L, Deng, Y.H, Fu, S.K
Published in Journal of magnetism and magnetic materials (01.06.2004)

by Fu, S.K., Lloyd, F., Forrest, C., Lawrance, I., Klopcic, B.
Published in Journal of Crohn's and colitis (01.02.2012)

by Khor, K.X., Rahman, H.A., Fu, S.K., Sim, L.S., Yeong, C.F., Su, E.L.M.
Published in Procedia computer science (2014)

by Ng, Y.-L., Klopcic, B., Fu, S.K., Lloyd, F., Lawrance, I.
Published in Journal of Crohn's and colitis (01.02.2012)

by Chang, H.K., Huang, H.Y., Lo, T.Y, Lee, S.K., Yang, K.W., Tang, C.L., Liu, Gary, Wu, C.T., Lin, M.H., Chu, W.C., Kuo, T.J., Fu, S.K., Tien, H.W., Tsai, C.H., Wei, Megan, Chen, H.P., Lee, M.H., Lu, C.W., Shue, Winston S., Cao, Min
Published in 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) (01.05.2023)