Array Termination Impacts in Advanced SRAM
Mann, Randy W., Puri, Sandeep, Sheng Xie, Marienfeld, Daniel, Versaggi, Joseph, Bianzhu Fu, Gribelyuk, Michael, Thankalekshmi, Ratheesh R., Xiaoqiang Zhang, Hui Zang, Weintraub, Chad E.
Published in IEEE transactions on very large scale integration (VLSI) systems (01.09.2017)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.09.2017)
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Journal Article
Detailed Microstructure Characterizations of BEOL Cu Interconnects
Fu, Bianzhu, Gribelyuk, Michael A., Choi, Seungman
Published in Microscopy and microanalysis (01.08.2018)
Published in Microscopy and microanalysis (01.08.2018)
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Journal Article
Quantification of Composition of Epitaxial Si/SiGe by EELS
Gribelyuk, Michael A., Zhao, Wayne, Fu, Bianzhu
Published in Microscopy and microanalysis (01.08.2018)
Published in Microscopy and microanalysis (01.08.2018)
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Journal Article
Application of Atom Probe on Fully Depleted Silicon-On-Insulator (FDSOI) Structures
Kambham, Ajay Kumar, Flatoff, Dan, Fu, Bianzhu
Published in Microscopy and microanalysis (01.07.2016)
Published in Microscopy and microanalysis (01.07.2016)
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Journal Article
Effects of high in-situ source/drain boron doping in p-FinFETs on physical and device performance characteristics
Shintri, Shashidhar, Yong, Chloe, Zhu, Baofu, Byrappa, Shayan, Fu, Bianzhu, Lo, Hsien-Ching, Choi, Dongil, Kolagunta, Venkat
Published in Materials science in semiconductor processing (01.08.2018)
Published in Materials science in semiconductor processing (01.08.2018)
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Journal Article
Characterization of VLSI Processing Defects Using STEM-EELS Tomography
Baumann, Frieder H., Miller, John, Rhoads, Bryan, Friedman, Anne, Fu, Bianzhu
Published in Microscopy and microanalysis (01.07.2016)
Published in Microscopy and microanalysis (01.07.2016)
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Journal Article
Effect of metal line width on electromigration of BEOL Cu interconnects
Choi, Seungman, Christiansen, Cathryn, Cao, Linjun, Zhang, James, Filippi, Ronald, Shen, Tian, Yeap, Kong Boon, Ogden, Sean, Zhang, Haojun, Fu, Bianzhu, Justison, Patrick
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
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Conference Proceeding
(Invited) Room Temperature Aging Effect Improvement for Device Stability and Manufacturability of FinFET Technologies
He, Xiaoli, Triyoso, Dina, Uppal, Suresh, Fu, Bianzhu, Zhang, Xing, Yamaguchi, Shimpei, Yong, Chloe, Liu, Bingwu, Joshi, Manoj, Samavedam, Srikanth
Published in ECS transactions (16.08.2017)
Published in ECS transactions (16.08.2017)
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Journal Article
3D Analytical TEM Approach to Effectively Characterize 3D-FinFET Device Features in Semiconductor Wafer-foundries
Zhao, Wayne, Mongeon, Stephen, Fu, Bianzhu, Chen, Esther (PY), Flatoff, Daniel, LaManque, Nicolas, Russell, Jeremy
Published in Microscopy and microanalysis (01.08.2014)
Published in Microscopy and microanalysis (01.08.2014)
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Journal Article
(Invited) Room Temperature Aging Effect Improvement for Device Stability and Manufacturability of FinFET Technologies
He, Xiaoli, Triyoso, Dina, Uppal, Suresh, Fu, Bianzhu, Zhang, Xing, Yamaguchi, Shimpei, Yong, Chloe, Liu, Bingwu, Joshi, Manoj, Samavedam, Srikanth
Published in Meeting abstracts (Electrochemical Society) (01.09.2017)
Published in Meeting abstracts (Electrochemical Society) (01.09.2017)
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Journal Article