Search Results - "Fry, Jonathan R" :: K.UTB vyhledávací portál

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Spatially localized thermal interface materials

by Fry, Jonathan R, Rizzolo, Michael, Sinha, Tuhin
Year of Publication 23.03.2021

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SPATIALLY LOCALIZED THERMAL INTERFACE MATERIALS

by Fry, Jonathan R, Rizzolo, Michael, Sinha, Tuhin
Year of Publication 24.09.2020

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Electro-mechanical fuse for detecting monitored component deflection

by Fry, Jonathan R, Kane, Michael R, Bradbury, Jonathan D
Year of Publication 30.06.2020

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Fracture ring sensor

by Fry, Jonathan R, Kane, Michael R, Bradbury, Jonathan D
Year of Publication 12.05.2020

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Method and structure for flip-chip package reliability monitoring using capacitive sensors groups

by Fry, Jonathan R, Davis, Taryn J, Sinha, Tuhin
Year of Publication 04.02.2020

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Electro-mechanical fuse for detecting monitored component deflection

by Fry, Jonathan R, Kane, Michael R, Bradbury, Jonathan D
Year of Publication 14.01.2020

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FRACTURE RING SENSOR

by Fry, Jonathan R, Kane, Michael R, Bradbury, Jonathan D
Year of Publication 17.10.2019

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Fracture ring sensor

by Fry, Jonathan R, Kane, Michael R, Bradbury, Jonathan D
Year of Publication 10.09.2019

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FRACTURE RING SENSOR

by Fry, Jonathan R, Kane, Michael R, Bradbury, Jonathan D
Year of Publication 11.04.2019

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FRACTURE RING SENSOR

by Fry, Jonathan R, Kane, Michael R, Bradbury, Jonathan D
Year of Publication 11.04.2019

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Patent

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ELECTRO-MECHANICAL FUSE FOR DETECTING MONITORED COMPONENT DEFLECTION

by Kane, Michael R, Bradbury, Jonathan D, FRY, Jonathan R
Year of Publication 04.04.2019

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ELECTRO-MECHANICAL FUSE FOR DETECTING MONITORED COMPONENT DEFLECTION

by Fry, Jonathan R, Kane, Michael R, Bradbury, Jonathan D
Year of Publication 04.04.2019

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Patent

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Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring

by Fry, Jonathan R, Davis, Taryn J, Sinha, Tuhin
Year of Publication 20.11.2018

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Damage detection system

by Fry, Jonathan R, Kane, Michael R, Nettey, Jeffrey, Bradbury, Jonathan D
Year of Publication 14.07.2020

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Method and structure for flip-chip package reliability monitoring using capacitive sensors groups

by Fry, Jonathan R, Davis, Taryn J, Sinha, Tuhin
Year of Publication 04.09.2018

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Patent

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Enhanced service procedures using force measurement

by Fry, Jonathan R, Kane, Michael R, Nettey, Jeffrey, Bradbury, Jonathan D
Year of Publication 30.06.2020

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Patent

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Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring

by Fry, Jonathan R, Davis, Taryn J, Sinha, Tuhin
Year of Publication 26.06.2018

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Enhanced service procedures using force measurement

by Fry, Jonathan R, Kane, Michael R, Nettey, Jeffrey, Bradbury, Jonathan D
Year of Publication 28.01.2020

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METHOD AND STRUCTURE FOR FLIP-CHIP PACKAGE RELIABILITY MONITORING USING CAPACITIVE SENSORS GROUPS

by Davis Taryn J, Sinha Tuhin, Fry Jonathan R
Year of Publication 15.02.2018

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METHOD AND STRUCTURE FOR FLIP-CHIP PACKAGE RELIABILITY MONITORING USING CAPACITIVE SENSORS GROUPS

by Davis Taryn J, Sinha Tuhin, Fry Jonathan R
Year of Publication 18.01.2018

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Patent

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