Use of optical metrology techniques for uniformity Control of 3D stacked IC's
Le Cunff, D., Tardif, M., Hotellier, N., Le Chao, K., Chapelon, L. L., Bar, P., Eynard, S., Piel, J. P., Fresquet, G.
Published in 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) (01.05.2014)
Published in 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) (01.05.2014)
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Conference Proceeding
A versatile optical system for metrology and defects inspection of 3D integration processes
Perrot, S., Randle, Y., Fresquet, G., Le Bellego, D., Petitgrand, S., Coste, P., Bosseboeuf, A.
Published in 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (01.05.2012)
Published in 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (01.05.2012)
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Conference Proceeding
Analysis and modeling of in situ boron-doped polysilicon deposition by LPCVD
FRESQUET, G, AZZARO, C, COUDERC, J.-P
Published in Journal of the Electrochemical Society (01.02.1995)
Published in Journal of the Electrochemical Society (01.02.1995)
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Journal Article
3D multi-stacking of thin dies based on TSV and micro-inserts interconnections
Souriau, Jean-Charles, Castagne, L., Liotard, J., Inal, K., Mazuir, J., Le Texier, F., Fresquet, G., Varvara, M., Launay, N., Dubois, B., Malia, T.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding