Transmission line comprising a layered stacked including metal and dielectric layers defining a stripline which is configured to meander in perpendicular meandering planes
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Year of Publication 21.05.2024
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Year of Publication 21.05.2024
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mm-Wellen RFID: Design und Implementierung eines Demonstrators
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Published in Elektrotechnik und Informationstechnik (01.06.2016)
Published in Elektrotechnik und Informationstechnik (01.06.2016)
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TRANSMISSION LINE
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Year of Publication 12.01.2023
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TRANSMISSION LINE
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Year of Publication 11.01.2023
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Year of Publication 11.01.2023
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Year of Publication 20.12.2023
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RF PACKAGE AND METHOD OF MANUFACTURE OF AN RF PACKAGE
Bergman, Jan Willem, Acar, Mustafa, Mattheijssen, Paul, Freidl, Philipp Franz, Mandamparambil, Rajesh
Year of Publication 14.12.2023
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Year of Publication 14.12.2023
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LOW LOSS TRANSMISSION LINE WITH STEPPED STRUCTURES
Leenaerts, Dominicus Martinus Wilhelmus, Chang, Danny Wayling, Acar, Mustafa, Freidl, Philipp Franz
Year of Publication 15.11.2023
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Year of Publication 15.11.2023
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LOW LOSS TRANSMISSION LINE WITH STEPPED STRUCTURES
Leenaerts, Dominicus Martinus Wilhelmus, Chang, Danny Wayling, Acar, Mustafa, Freidl, Philipp Franz
Year of Publication 09.11.2023
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Year of Publication 09.11.2023
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FLIP CHIP DEVICE THROUGH PACKAGE VIA PLACEMENT
Bergman, Jan Willem, Acar, Mustafa, Kamphuis, Antonius Hendrikus Jozef, Freidl, Philipp Franz, Mandamparambil, Rajesh
Year of Publication 01.11.2023
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Year of Publication 01.11.2023
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FLIP CHIP DEVICE THROUGH PACKAGE VIA PLACEMENT
Bergman, Jan Willem, Acar, Mustafa, Kamphuis, Antonius Hendrikus Jozef, Freidl, Philipp Franz, Mandamparambil, Rajesh
Year of Publication 20.09.2023
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Year of Publication 20.09.2023
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FLIP CHIP DEVICE THROUGH PACKAGE VIA PLACEMENT
Bergman, Jan Willem, Acar, Mustafa, Kamphuis, Antonius Hendrikus Jozef, Freidl, Philipp Franz, Mandamparambil, Rajesh
Year of Publication 14.09.2023
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Year of Publication 14.09.2023
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RF COMPONENT AND METHOD
Bergman, Jan Willem, Acar, Mustafa, Kamphuis, Antonius Hendrikus Jozef, Freidl, Philipp Franz
Year of Publication 15.06.2023
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Year of Publication 15.06.2023
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RF COMPONENT AND METHOD
KAMPHUIS, Antonius Hendrikus Jozef, BERGMAN, Jan Willem, FREIDL, Philipp Franz, ACAR, Mustafa
Year of Publication 14.06.2023
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Year of Publication 14.06.2023
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GROUNDING ASSEMBLY FOR A SEMICONDUCTOR DEVICE
Bergman, Jan Willem, Acar, Mustafa, Kamphuis, Antonius Hendrikus Jozef, Freidl, Philipp Franz, Mandamparambil, Rajesh
Year of Publication 01.12.2022
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Year of Publication 01.12.2022
Patent
GROUNDING ASSEMBLY FOR A SEMICONDUCTOR DEVICE
KAMPHUIS, Antonius Hendrikus Jozef, BERGMAN, Jan Willem, MANDAMPARAMBIL, Rajesh, ACAR, Mustafa, FREIDL, Philipp Franz
Year of Publication 30.11.2022
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Year of Publication 30.11.2022
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ON-CHIP SHIELDED DEVICE
Bergman, Jan Willem, Acar, Mustafa, Mattheijssen, Paul, Kamphuis, Antonius Hendrikus Jozef, Giannakidis, Konstantinos, Freidl, Philipp Franz, Björk, Erik Daniel, Mandamparambil, Rajesh
Year of Publication 11.07.2024
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Year of Publication 11.07.2024
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