Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu
Lee, T. Y., Choi, W. J., Tu, K. N., Jang, J. W., Kuo, S. M., Lin, J. K., Frear, D. R., Zeng, K., Kivilahti, J. K.
Published in Journal of materials research (01.02.2002)
Published in Journal of materials research (01.02.2002)
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Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling
Wong, E.H., Selvanayagam, C.S., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Frear, D.R., Leoni, M., Lai, Y.-S., Yeh, C.-L.
Published in Journal of electronic materials (01.06.2008)
Published in Journal of electronic materials (01.06.2008)
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Journal Article
Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy
RAMANATHAN, L. N, JANG, J. W, UN, J. K, FREAR, D. R
Published in Journal of electronic materials (01.10.2005)
Published in Journal of electronic materials (01.10.2005)
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Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability
Kelly, Marion Branch, Maity, Tapabrata, Nazmus Sakib, A. R., Frear, D. R., Chawla, Nikhilesh
Published in Journal of electronic materials (01.05.2020)
Published in Journal of electronic materials (01.05.2020)
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Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability
Kelly, Marion Branch, Maity, Tapabrata, Nazmus Sakib, A. R., Frear, D. R., Chawla, Nikhilesh
Published in Journal of electronic materials (01.07.2020)
Published in Journal of electronic materials (01.07.2020)
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Journal Article
Secondary Current Crowding Effect during Electromigration of Flip-Chip Solder Joints
Jang, J.W., Ramanathan, L.N., Tang, J., Frear, D.R.
Published in Journal of electronic materials (01.02.2008)
Published in Journal of electronic materials (01.02.2008)
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Journal Article
High-lead flip chip bump cracking on the thin organic substrate in a module package
Jang, J.W., Li, L., Bowles, P., Bonda, R., Frear, D.R.
Published in Microelectronics and reliability (01.02.2012)
Published in Microelectronics and reliability (01.02.2012)
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Journal Article
Interfacial Morphology and Shear Deformation of Flip Chip Solder Joints
Jang, J. W., Liu, C. Y., Kim, P. G., Tu, K. N., Mal, A. K., Frear, D. R.
Published in Journal of materials research (01.08.2000)
Published in Journal of materials research (01.08.2000)
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Journal Article
Stress–strain characteristics of tin-based solder alloys at medium strain rate
Wong, E.H., Selvanayagam, C.S., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Frear, D.R., Leoni, M., Lai, Y.-S., Yeh, C.-L.
Published in Materials letters (30.06.2008)
Published in Materials letters (30.06.2008)
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