A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface
Haubold, M., Lin, Y.-C., Frömel, J., Wiemer, M., Esashi, M., Geßner, T.
Published in Microsystem technologies : sensors, actuators, systems integration (01.04.2012)
Published in Microsystem technologies : sensors, actuators, systems integration (01.04.2012)
Get full text
Journal Article
Wafer level encapsulation of microsystems using glass frit bonding
KNECHTEL, R, WIEMER, M, FRÖMEL, J
Published in Microsystem technologies : sensors, actuators, systems integration (01.04.2006)
Published in Microsystem technologies : sensors, actuators, systems integration (01.04.2006)
Get full text
Journal Article
Development and evaluation of AuSi eutectic wafer bonding
Lin, Y.-C., Baum, M., Haubold, M., Fromel, J., Wiemer, M., Gessner, T., Esashi, M.
Published in TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference (01.06.2009)
Published in TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference (01.06.2009)
Get full text
Conference Proceeding
A hierarchic bonding procedure for the assembly of micro confocal microscope
Jia, C., Fromel, J., Wiemer, M., Gessner, T., Bargiel, S., Passilly, N., Baranski, M., Gorecki, C.
Published in 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (01.05.2012)
Published in 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (01.05.2012)
Get full text
Conference Proceeding
Micro-optical design of a three-dimensional microlens scanner for vertically integrated micro-opto-electro-mechanical systems
Baranski, Maciej, Bargiel, Sylwester, Passilly, Nicolas, Gorecki, Christophe, Jia, Chenping, Frömel, Jörg, Wiemer, Maik
Published in Applied optics. Optical technology and biomedical optics (01.08.2015)
Published in Applied optics. Optical technology and biomedical optics (01.08.2015)
Get more information
Journal Article
Room temperature vacuum sealing using surfaced activated bonding with Au thin films [microresonator example]
Okada, H., Itoh, T., Fromel, J., Gessner, T., Suga, T.
Published in The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05 (2005)
Published in The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05 (2005)
Get full text
Conference Proceeding
Low temperature metal interdiffusion bonding for micro devices
Fromel, J., Lin, Y.-C, Wiemer, M., Gessner, T., Esashi, M.
Published in 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (01.05.2012)
Published in 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (01.05.2012)
Get full text
Conference Proceeding
Wafer-level fabricated micro beam splitter based on 45-degree saw dicing of glass substrate
Bargiel, S., Baranski, M., Passilly, N., Guichardaz, B., Herth, E., Gorecki, C., Jia, C., Fromel, J., Wiemer, M.
Published in 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII) (01.06.2013)
Published in 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII) (01.06.2013)
Get full text
Conference Proceeding
Nanofabrication of reactive structure for low temperature bonding
Yu-Ching Lin, Brauer, J, Hofmann, L, Baum, M, Fromel, J, Wiemer, M, Esashi, M, Gessner, T
Published in 2009 IEEE 3rd International Conference on Nano/Molecular Medicine and Engineering (01.10.2009)
Published in 2009 IEEE 3rd International Conference on Nano/Molecular Medicine and Engineering (01.10.2009)
Get full text
Conference Proceeding