Effect of substrate warpage on flip chip BGA thermal stress simulation
Chai Chee Meng, Stoeckl, S, Pape, H, Foo Mun Yee, Tan Ai Min
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Thermo-mechanical modeling of a 3D flip chip fully populated BGA package
Chai, Chee Meng, Stoeckl, Stephan, Pape, Heinz, Mun Yee, Foo, Tan Ai Min, Tan
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
The impact of high glass transition temperature of molding compounds on power package warpage and stress performance
Ge, Dandong, Subramanian, N. R., Yong, Khai Seen, Foo, Mun Yee, Gan, Swee Lee
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding