Adhesion Characterization and Enhancement between Polyimide-Silica Composite and Nodulated Copper for Applications in Next-Generation Microelectronics
Doshi, Sagar M., Barry, Alexander, Schneider, Alexander, Parambil, Nithin, Mulzer, Catherine, Yahyazadehfar, Mobin, Samadi-Dooki, Aref, Foltz, Benjamin, Warrington, Keith, Wessel, Richard, Zhang, Lei, Simone, Christopher, Blackman, Gregory S., Lamontia, Mark A., Gillespie, John W.
Published in ACS applied materials & interfaces (17.01.2024)
Published in ACS applied materials & interfaces (17.01.2024)
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Journal Article
Mapping chemical and mechanical property degradation in photovoltaic modules
Stika, Katherine M., Westphal, Craig S., Kapur, Jane, Raty, R. Gail, Jing Li, Kopchick, James G., Gambogi, William J., Hamzavytehrany, Babak, Bradley, Alexander Z., Marsh, James R., Foltz, Benjamin W.
Published in 2014 IEEE 40th Photovoltaic Specialist Conference (PVSC) (01.06.2014)
Published in 2014 IEEE 40th Photovoltaic Specialist Conference (PVSC) (01.06.2014)
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Conference Proceeding