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Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.11.1998)
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Conference Proceeding
Thermap: a thermal model for microprocessors
Fitch, J.S., Monier, L., Tamet, H.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01.09.1995)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01.09.1995)
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Packaging a 150-W bipolar ECL microprocessor
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Published in IEEE transactions on components, hybrids, and manufacturing technology (01.02.1993)
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.02.1993)
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Conference Proceeding