Manufacturing aspects of low pressure chemical-vapor-deposited TiN barrier layers
Get full text
Journal Article
Conference Proceeding
Characterization of copper voids in damascene processes
Guldi, R.L., Shaw, J.B., Ritchison, J., Corum, D.L., Oestreich, S., Sherman, K., Lin, J.H., Fiordalice, R.
Published in IEEE transactions on semiconductor manufacturing (01.11.2004)
Published in IEEE transactions on semiconductor manufacturing (01.11.2004)
Get full text
Journal Article
Orientation control of chemical vapor deposition TiN film for barrier applications
FIORDALICE, R. W, HEGDE, R. I, KAWASAKI, H
Published in Journal of the Electrochemical Society (01.06.1996)
Published in Journal of the Electrochemical Society (01.06.1996)
Get full text
Journal Article
A low temperature collimated titanium deposition process
HEGDE, R. I, FIORDALICE, R. W, KOLAR, D
Published in Journal of the Electrochemical Society (01.05.1997)
Published in Journal of the Electrochemical Society (01.05.1997)
Get full text
Journal Article
Raman scattering characterization of titanium silicide formation
Nemanich, R. J., Fiordalice, R. W., Jeon, H.
Published in IEEE journal of quantum electronics (01.05.1989)
Published in IEEE journal of quantum electronics (01.05.1989)
Get full text
Journal Article
Rapid interconnect development using an area accelerated electron beam inspection methodology
Shaw, J., Guldi, R., Kim, T., Corum, D., Ritchison, J., Oestreich, S., Lin, J., Weiner, K., Davis, K., Fiordalice, R.
Published in Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) (2002)
Published in Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) (2002)
Get full text
Conference Proceeding
Characterization of copper voids in dual damascene processes
Guldi, R.L., Shaw, J.B., Ritchison, J., Oestreich, S., Davis, K., Fiordalice, R.
Published in 13th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference. Advancing the Science and Technology of Semiconductor Manufacturing. ASMC 2002 (Cat. No.02CH37259) (2002)
Published in 13th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference. Advancing the Science and Technology of Semiconductor Manufacturing. ASMC 2002 (Cat. No.02CH37259) (2002)
Get full text
Conference Proceeding
Process module control for low-/spl kappa/ dielectrics [CVD]
Hayzelden, C., Ygartua, C., Casavant, T., Slessor, M., Srivatsa, A., Guevremont, M., Stevens, P., Young, M., Lu, T., Zhang, R., Treadwell, C., Soltz, D., Lauber, J., Krumbuegel, M., Fiordalice, R., Lange, S., Marella, R., Ashkenaz, S., Monahan, K., Tran, T.K., Jihperng Leu
Published in Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130) (2000)
Published in Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130) (2000)
Get full text
Conference Proceeding
CVD Cu process integration for sub-0.25 /spl mu/m technologies
Zhang, J., Denning, D., Braeckelmann, G., Venkatraman, R., Fiordalice, R., Weitzman, E.
Published in Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) (1998)
Published in Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) (1998)
Get full text
Conference Proceeding
A low temperature CVD Al plug and interconnect process for 0.25 /spl mu/m metallization technologies
Fiordalice, R., Blumenthal, R., Fernandes, M., Garcia, S., Gelatos, J., Kawasaki, H., Klein, J., Marsh, R., Ong, T., Venkatraman, R., Weitzman, E., Pintchovski, F.
Published in 1996 Symposium on VLSI Technology. Digest of Technical Papers (1996)
Published in 1996 Symposium on VLSI Technology. Digest of Technical Papers (1996)
Get full text
Conference Proceeding