Adult depression screening in Saudi primary care: prevalence, instrument and cost
Al-Qadhi, Waleed, Ur Rahman, Saeed, Ferwana, Mazen S, Abdulmajeed, Imad Addin
Published in BMC psychiatry (03.07.2014)
Published in BMC psychiatry (03.07.2014)
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Journal Article
Two-Dimensional Flex Sensor Exploiting Stacked Ultrathin Chips
Endler, S., Ferwana, S., Rempp, H., Harendt, C., Burghartz, J. N.
Published in IEEE electron device letters (01.03.2012)
Published in IEEE electron device letters (01.03.2012)
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Journal Article
Manufacturing aspects of an ultra-thin chip technology
Angelopoulos, E. A., Al-Shahed, M. S., Appel, W., Endler, S., Ferwana, S., Harendt, C., Hassan, M., Rempp, H., Zimmermann, M., Burghartz, J. N.
Published in 2012 Proceedings of the European Solid-State Device Research Conference (ESSDERC) (01.09.2012)
Published in 2012 Proceedings of the European Solid-State Device Research Conference (ESSDERC) (01.09.2012)
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Conference Proceeding
A flexible stress sensor using a sub-10μm silicon chip technology
Ferwana, S., Angelopoulos, E. A., Endler, S., Harendt, C., Burghartz, J. N.
Published in 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII) (01.06.2013)
Published in 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII) (01.06.2013)
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Conference Proceeding
Low-cost CMOS compatible sintered porous silicon technique for microbolometer manufacturing
Etter, D. B., Zimmermann, M., Ferwana, S., Hutter, F. X., Burghartz, J. N.
Published in 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS) (01.01.2012)
Published in 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS) (01.01.2012)
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Conference Proceeding
Ultra-thin Si chips for flexible electronics Process technology, characterization, assembly and applications
Burghartz, J. N., Angelopoulos, E., Appel, W., Endler, S., Ferwana, S., Harendt, C., Hassan, M.-U, Rempp, H., Richter, H., Zimmermann, M.
Published in 28th Symposium on Microelectronics Technology and Devices (SBMicro 2013) (01.09.2013)
Published in 28th Symposium on Microelectronics Technology and Devices (SBMicro 2013) (01.09.2013)
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Conference Proceeding
Ultra-thin chip technology for system-in-foil applications
Angelopoulos, E A, Zimmermann, M, Appel, W, Endler, S, Ferwana, S, Harendt, C, Tu Hoang, Pruemm, A, Burghartz, J N
Published in 2010 International Electron Devices Meeting (01.12.2010)
Published in 2010 International Electron Devices Meeting (01.12.2010)
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Conference Proceeding
Ultra-thin chips for flexible electronics
Burghartz, J. N., Angelopoulos, E., Appel, W., Endler, S., Ferwana, S., Harendt, C., Hassan, M.-U, Rempp, H., Richter, H., Zimmermann, M.
Published in 2013 IEEE International Conference of Electron Devices and Solid-state Circuits (01.06.2013)
Published in 2013 IEEE International Conference of Electron Devices and Solid-state Circuits (01.06.2013)
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Conference Proceeding