Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
Fengze Hou, Tingyu Lin, Liqiang Cao, Fengman Liu, Jun Li, Xuejun Fan, Zhang, G. Q.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2017)
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Journal Article
High-Bandwidth Lumped Mach-Zehnder Modulators Based on Thin-Film Lithium Niobate
Yang, Peng, Sun, Siwei, Zhang, Yuqiang, Cao, Rui, He, Huimin, Xue, Haiyun, Liu, Fengman
Published in Photonics (01.05.2024)
Published in Photonics (01.05.2024)
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Journal Article
A novel dual-lens-coupling system for DFB laser based on hybrid integration
Wei, Juan, Sun, Yu, Xue, Haiyun, He, Huimin, Sun, Siwei, Liu, Fengman, Cao, Liqiang
Published in Optoelectronics letters (01.07.2021)
Published in Optoelectronics letters (01.07.2021)
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Journal Article
Co-packaged optics (CPO): status, challenges, and solutions
Tan, Min, Xu, Jiang, Liu, Siyang, Feng, Junbo, Zhang, Hua, Yao, Chaonan, Chen, Shixi, Guo, Hangyu, Han, Gengshi, Wen, Zhanhao, Chen, Bao, He, Yu, Zheng, Xuqiang, Ming, Da, Tu, Yaowen, Fu, Qiang, Qi, Nan, Li, Dan, Geng, Li, Wen, Song, Yang, Fenghe, He, Huimin, Liu, Fengman, Xue, Haiyun, Wang, Yuhang, Qiu, Ciyuan, Mi, Guangcan, Li, Yanbo, Chang, Tianhai, Lai, Mingche, Zhang, Luo, Hao, Qinfen, Qin, Mengyuan
Published in Frontiers of Optoelectronics (Online) (20.03.2023)
Published in Frontiers of Optoelectronics (Online) (20.03.2023)
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Journal Article
Design and Implementation of a High-Coupling and Multichannel Optical Transceiver With a Novel Packaging Structure
He, Huimin, Liu, Fengman, Xue, Haiyun, Wu, Peng, Song, Mangu, Chen, Cheng, Sun, Yu, Cao, Liqiang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2017)
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Journal Article
Effects on carbon, nitrogen, and phosphorus cycling functional genes under straw mulching and fallow cultivation
Wang Genlin, Duan, Yan, Liu, Zhengyu, Wang, Yiyang, Liu Fengman, Sun, Lei, Li, Yumei
Published in Journal of agricultural resources and environment (01.01.2024)
Published in Journal of agricultural resources and environment (01.01.2024)
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Journal Article
A 9pJ/bit SOP optical transceiver with 80 Gbps two-way bandwidth
Liu Fengman, Li Baoxia, Li Zhihua, Wan Lixi, Gao Wei, Chu Yanbiao, Du Tianmin, Song Jian, Xiang Haifei, Wang Haidong, Yang Kun, Yang Binbin
Published in 2011 Asia Communications and Photonics Conference and Exhibition (ACP) (2011)
Published in 2011 Asia Communications and Photonics Conference and Exhibition (ACP) (2011)
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Conference Proceeding
Optimizing Hierarchical 3-D Floorplanning with simulated annealing Algorithm
Chengyi, Liao, Qi, Zheng, Fengman, Liu, Huimin, He, Qidong, Wang
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
Design and Realization of Multi-Channel and High-Bandwidth 2.5D Transmitter Integrated With Silicon Photonic MZM
He, Huimin, Xue, Haiyun, Sun, Yu, Liu, Fengman, Cao, Liqiang
Published in Journal of lightwave technology (01.08.2022)
Published in Journal of lightwave technology (01.08.2022)
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Journal Article
A 10-Gbps x 12-Channel Pluggable Parallel Optical Transceiver Based on CXP Interface Specifications
KUN YANG, ZHIHUA LI, BAOXIA LI, WEI GAO, FENGMAN LIU, JIAN SONG, LIXI WAN
Published in Fiber and integrated optics (2012)
Published in Fiber and integrated optics (2012)
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Journal Article
High-sensitivity MEMS force and acceleration sensor based on graphene-induced non-radiative transition
Li, Guanghui, Liu, Fengman, Yang, Shengyi, Liu, Jiang-Tao, Li, Weimin, Wu, Zhenhua
Published in Carbon (New York) (05.06.2023)
Published in Carbon (New York) (05.06.2023)
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Journal Article
Challenges and Technologies of Frontside Via-Last Active-Interposer Processes on Low-k Material for 3D Chiplet
Cao, Rui, He, Huimin, Chen, Lijun, Liao, Chengyi, Liu, Fengman, Cao, Liqiang, Wang, Qidong
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (22.08.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (22.08.2024)
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Journal Article
Enhanced Fabrication and Assembly of 3-D Chiplets Based on Active Interposer with Frontside Via-last TSVs
Liao, Chengyi, He, Huimin, Wang, Xugang, Cao, Rui, Chen, Lijun, Peng, Cheng, Liu, Fengman, Cao, Liqiang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (14.08.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (14.08.2024)
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Journal Article
High Positional Resolution Pin-Cushion Position Sensitive Detector by Deliberately Introducing Barrel Distortion
Sun, Siwei, Zheng, Qi, Meng, Xiangxu, Sun, Peng, Liu, Fengman, Cao, Liqiang
Published in IEEE sensors journal (15.01.2022)
Published in IEEE sensors journal (15.01.2022)
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Journal Article