by Zheng, Qi, Yang, Peng, Xue, Haiyun, He, Huimin, Cao, Rui, Dai, Fengwei, Sun, Siwei, Liu, Fengman, Wang, Qidong, Cao, Liqiang, Chen, Lijun, Sun, Xuyan, Sun, Peng
Published in Journal of lightwave technology (15.09.2022)

by He, Jian, Lu, Donglai, Xue, Haiyun, Chen, Sikai, Liu, Han, Li, Leliang, Li, Guike, Zhang, Zhao, Liu, Jian, Liu, Liyuan, Wu, Nanjian, Yu, Ningmei, Liu, Fengman, Xiao, Xi, Chen, Yong, Qi, Nan
Published in IEEE transactions on circuits and systems. I, Regular papers (01.11.2022)

by Yang, Peng, Sun, Siwei, Xue, Haiyun, Zheng, Qi, He, Huimin, Meng, XiangXu, Liu, Fengman, Cao, Liqiang
Published in Optics and laser technology (01.02.2023)

by Hou, Fengze, Zhang, Hengyun, Huang, Dezhu, Fan, Jiajie, Liu, Fengman, Lin, Tingyu, Cao, Liqiang, Fan, Xuejun, Ferreira, Braham, Zhang, Guoqi
Published in IEEE transactions on power electronics (01.10.2020)

by Hou, Fengze, Zhang, Hengyun, Huang, Dezhu, Fan, Jiajie, Liu, Fengman, Lin, Tingyu, Cao, Liqiang, Fan, Xuejun, Ferreira, Braham, Zhang, Guoqi
Published in IEEE transactions on power electronics (01.10.2020)

by Liu, Jun, Ye, Yao, Deng, Lei, Liu, Lei, Li, Zhiyong, Liu, Fengman, Zhou, Yunyan, Xia, Jinsong, Liu, Deming
Published in Optics express (20.08.2018)

by Chen, Cheng, Hou, Fengze, Liu, Fengman, She, Qian, Cao, Liqiang, Wan, Lixi
Published in Microelectronics and reliability (01.12.2017)

by Cheng Chen, Delong Qiu, Fengze Hou, Fengman Liu, Meiying Su, Qidong Wang, Liqiang Cao, Lixi Wan
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)

by Zheng, Qi, Xue, Haiyun, Liu, Fengman, Cao, Liqiang, Wang, Qidong, He, Huimin, Dai, Fengwei, Sun, Peng
Published in Processes (01.11.2022)

by Wu, Peng, Liu, Fengman, Li, Jun, Chen, Cheng, Hou, Fengze, Cao, Liqiang, Wan, Lixi
Published in Microsystem technologies : sensors, actuators, systems integration (01.10.2017)

by Li, Weizeng, Wang, Linfang, Li, Zhi, Ye, Wang, Zhou, Zhidao, Zhou, Haiyang, Gao, Hanghang, Yue, Jinshan, Hu, Hongyang, Liu, Fengman, Luo, Qing, Dou, Chunmeng
Published in 2024 IEEE International Symposium on Circuits and Systems (ISCAS) (19.05.2024)

by Lin, Laicun, Jing, Xiangmeng, Liu, Fengman, Yin, Wen, Yu, Daquan, Cao, Liqiang
Published in Journal of materials science. Materials in electronics (2017)

by Liu, Fengman, He, Huimin, Xue, Haiyun, Song, Mangu, Dai, Fengwei, Sun, Yu, Wu, Peng, Cao, Liqiang
Published in Microwave and optical technology letters (01.12.2017)

by Yi He, Jun Li, Fengman Liu, Peng Wu, Liqiang Cao
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)

by Peng Wu, Huimin He, Yi He, Lixi Wan, Fengman Liu, Jun Li, Liqiang Cao
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)

by Wu, Peng, Hou, Fengze, Chen, Cheng, Li, Jun, Liu, Fengman, Zhang, Jing, Cao, Liqiang, Wan, Lixi
Published in Microelectronics and reliability (01.10.2016)

by Fengze Hou, Yunyan Zhou, Fengman Liu, Meiying Su, Cheng Chen, Jun Li, Tingyu Lin, Liqiang Cao
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

by Fengze Hou, Fengman Liu, Yi He, Xiaomeng Wu, Xia Zhang, Liqiang Cao, Yuan Lu, Shangguan, Dongkai
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)

by Lin, Laicun, Jing, Xiangmeng, Liu, Fengman, Yin, Wen, Yu, Daquan, Cao, Liqiang
Published in Journal of materials science. Materials in electronics (01.01.2017)

by Lin, Laicun, Jing, Xiangmeng, Liu, Fengman, Yin, Wen, Yu, Daquan, Cao, Liqiang
Published in Journal of materials science. Materials in electronics (01.01.2017)