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Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
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The Collaborative Design for the Package of High - speed Interface Chip
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Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
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The multi-dimension co-design for the package of the high-speed multi-function chip
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Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Modeling and Simulation of Interconnection Structure Compensation Design in High-speed Modules
Zheng, Qi, He, Huimin, Bai, Lijuan, Wang, Yubo, Li, Dejian, Han, Shunfeng, Li, Bofu, Li, Dameng, Liu, Fengman, Cao, Liqiang
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
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The Collaborative Design for the Package of High - speed Interface Chip
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Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
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Research on high-speed transmission characteristics of the BGA ceramic substrate employed in multi-channel optical transmitter module
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Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
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Conference Proceeding
Segmented Mach-Zehnder Modulator for High-level PAM Generation
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Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
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The Research on Multi-Channels Optical Receiver Module for High-Speed Optical Interconnection
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Published in 2019 20th International Conference on Electronic Packaging Technology(ICEPT) (01.08.2019)
Published in 2019 20th International Conference on Electronic Packaging Technology(ICEPT) (01.08.2019)
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Conference Proceeding
Research on Optical interconnect transmitter based on Mach-Zehnder silicon optical chip
Zheng, Qi, He, Huimin, Liu, Fengman, Wei, Juan, Sun, Yu, Xue, Haiyun, Sun, Siwei, Li, Zhixiong, Cao, Liqiang
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
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Study on Characteristics of Mach-Zehnder Electro-Optical Modulator
Li, Zhixiong, Liu, Fengman, Sun, Yu, He, Huimin, Xue, Haiyun, Wei, Juan
Published in 2019 20th International Conference on Electronic Packaging Technology(ICEPT) (01.08.2019)
Published in 2019 20th International Conference on Electronic Packaging Technology(ICEPT) (01.08.2019)
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The Signal Integrity Design And Optimization of High Speed RF Optical Receiver Module
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Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
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