Electrical Behavior of Phase-Change Memory Cells Based on GeTe
Perniola, Luca, Sousa, Veronique, Fantini, Andrea, Arbaoui, Edrisse, Bastard, Audrey, Armand, Marilyn, Fargeix, Alain, Jahan, Carine, Nodin, Jean-Francois, Persico, Alain, Blachier, Denis, Toffoli, Alain, Loubriat, Sebastien, Gourvest, Emanuel, Betti Beneventi, Giovanni, Feldis, Helene, Maitrejean, Sylvain, Lhostis, Sandrine, Roule, Anne, Cueto, Olga, Reimbold, Gilles, Poupinet, Ludovic, Billon, Thierry, De Salvo, Barbara, Bensahel, Daniel, Mazoyer, Pascale, Annunziata, Roberto, Zuliani, Paola, Boulanger, Fabien
Published in IEEE electron device letters (01.05.2010)
Published in IEEE electron device letters (01.05.2010)
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Journal Article
Impact of the Volatile Acid Contaminants on Copper Interconnects Electrical Performances
Fontaine, Hervé, Feldis, Hélène, Danel, Adrien, Cetre, Sylviane, Ailhas, Christelle
Published in ECS transactions (01.01.2009)
Published in ECS transactions (01.01.2009)
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Journal Article
Impact of the Volatile Acid Contaminants on Cu Interconnects Electrical Performances
Fontaine, Hervé, Feldis, Hélène, Danel, Adrien
Published in Meeting abstracts (Electrochemical Society) (10.07.2009)
Published in Meeting abstracts (Electrochemical Society) (10.07.2009)
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Journal Article
High density 3D silicon interposer technology development and electrical characterization for high end applications
Charbonnier, Jean, Assous, Myriam, Bally, Jean-Philippe, Miyairi, Ken, Sunohara, Masahiro, Cuchet, Robert, Feldis, Helene, Bouzaida, Nicole, Bernard-Henriques, Nathalie, Hida, Rachid, Mourier, Thierry, Simon, Gilles, Higashi, Mitsutoshi
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Conference Proceeding
Electrical and morphological characterization for high integrated silicon interposer and technology transfer from 200 mm to 300mm wafer
Sunohara, Masahiro, Miyairi, Ken, Mori, Kenichi, Murayama, Kei, Charbonnier, Jean, Assous, Myriam, Bally, Jean-Philippe, Mourier, Thierry, Minoret, Stephane, Mercier, Denis, Toffoli, Alain, Allain, Fabienne, Martinez, Eugenie, Feldis, Helene, Simon, Gilles, Higashi, Mitsutoshi
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
A successful implementation of dual damascene architecture to copper TSV for 3D high density applications
El Farhane, Rebha, Assous, M, Leduc, P, Thuaire, A, Bouchu, D, Feldis, H, Sillon, N
Published in 2010 IEEE International 3D Systems Integration Conference (3DIC) (01.11.2010)
Published in 2010 IEEE International 3D Systems Integration Conference (3DIC) (01.11.2010)
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Conference Proceeding