Ultrafine Pitch (6 \mu\hbox) of Recessed and Bonded Cu-Cu Interconnects by Three-Dimensional Wafer Stacking
Peng, Lan, Zhang, Lin, Fan, Ji, Li, Hong Yu, Lim, Dau Fatt, Tan, Chuan Seng
Published in IEEE electron device letters (01.12.2012)
Published in IEEE electron device letters (01.12.2012)
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Journal Article
Wafer-on-Wafer Stacking by Bumpless Cu-Cu Bonding and Its Electrical Characteristics
Tan, Chuan Seng, Peng, Lan, Li, Hong Yu, Lim, Dau Fatt, Gao, Shan
Published in IEEE electron device letters (01.07.2011)
Published in IEEE electron device letters (01.07.2011)
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Journal Article
STI HDP process effect on yield of embedded memory processes
Lim Dau Fatt, Yang Yue, Guai Guan Hong, Tang Pey Chyi, Goh Tat Kean, Lin Tao, Venkataramani, Chandrasekar, Pak Koesun
Published in 2016 International Symposium on Semiconductor Manufacturing (ISSM) (01.12.2016)
Published in 2016 International Symposium on Semiconductor Manufacturing (ISSM) (01.12.2016)
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Conference Proceeding
Pre-O2 treatment for LNA gate oxide leakage improvement
Ke, Zheng, Goyal, Sachin, Arputharaj, Solomon, Wendy Lau, Wee Yee, Tam Lyn, Tan, Fatt, Lim Dau, Madhavan, Pandurangan, Venkataramani, Chandrasekar
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01.03.2022)
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01.03.2022)
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Conference Proceeding
Low temperature bump-less Cu-Cu bonding enhancement with self assembled monolayer (SAM) passivation for 3-D integration
Dau Fatt Lim, Jun Wei, Chee Mang Ng, Chuan Seng Tan
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation
Dau Fatt Lim, Govind Singh, S., Xiao Fang Ang, Jun Wei, Chee Mang Ng, Chuan Seng Tan
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
Application of self assembly monolayer (SAM) in lowering the process temperature during Cu-Cu diffusion bonding of 3D IC
Dau Fatt Lim, Singh, S.G., Xiao Fang Ang, Jun Wei, Chee Mang Ng, Chuan Seng Tan
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
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Conference Proceeding
Single-mode narrow beam divergence surface-emitting concentric-circular-grating terahertz quantum cascade lasers
Guozhen Liang, Houkun Liang, Ying Zhang, Khanna, S. P., Lianhe Li, Davies, A. G., Linfield, E., Dau Fatt Lim, Chuan Seng Tan, Siu Fung Yu, Hui Chun Liu, Qi Jie Wang
Published in 2012 Photonics Global Conference (PGC) (01.12.2012)
Published in 2012 Photonics Global Conference (PGC) (01.12.2012)
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Conference Proceeding