Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
Santagata, F., Fiorentino, G., Nie, M., Farriciello, C., Poelma, R., Zhang, G. Q., Sarro, P. M.
Published in 2012 IEEE Sensors (01.10.2012)
Published in 2012 IEEE Sensors (01.10.2012)
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