Implant after through-silicon via (TSV) etch to getter mobile ions
Greene, Brian J, Graves-Abe, Troy L, Collins, Christopher, Hannon, Robert, Ho, Herbert L, Farooq, Mukta G, Kothandaraman, Chandrasekharan
Year of Publication 01.01.2019
Get full text
Year of Publication 01.01.2019
Patent
DEVICE LAYER TRANSFER WITH A PRESERVED HANDLE WAFER SECTION
Stamper Anthony K, Jaffe Mark D, Fitzsimmons John A, Farooq Mukta G, Wolf Randy L
Year of Publication 04.01.2018
Get full text
Year of Publication 04.01.2018
Patent
3D INTEGRATED CIRCUIT DEVICE FABRICATION
YU, Roy, R, FAROOQ, Mukta, G, PORUSHOTHAMAN, Sampath, KOESTER, Steven, J, IYER, Subramanian, S, HANNON, Robert
Year of Publication 21.11.2018
Get full text
Year of Publication 21.11.2018
Patent
Flip chip alignment mark exposing method enabling wafer level underfill
Polomoff Nicholas A, Petrarca Kevin S, Sakuma Katsuyuki, Farooq Mukta G
Year of Publication 21.11.2017
Get full text
Year of Publication 21.11.2017
Patent
Device layer transfer with a preserved handle wafer section
Stamper Anthony K, Jaffe Mark D, Fitzsimmons John A, Farooq Mukta G, Wolf Randy L
Year of Publication 14.11.2017
Get full text
Year of Publication 14.11.2017
Patent
INSULATING A VIA IN A SEMICONDUCTOR SUBSTRATE
SIMON ANDREW H, REARDON NICOLE R, PETRARCA KEVIN S, OAKLEY JENNIFER A, FAROOQ MUKTA G
Year of Publication 07.09.2017
Get full text
Year of Publication 07.09.2017
Patent